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Ultrathin, Transferred Layers of Silicon Oxynitrides as Tunable Biofluid Barriers for Bioresorbable Electronic Systems.
Hu, Ziying; Zhao, Jie; Guo, Hexia; Li, Rui; Wu, Mingzheng; Shen, Jiahong; Wang, Yue; Qiao, Zheng; Xu, Yue; Haugstad, Greg; An, Dongqi; Xie, Zhaoqian; Kandela, Irawati; Nandoliya, Khizar R; Chen, Yu; Yu, Yi; Yuan, Qunyao; Hou, Junyu; Deng, Yujun; AlDubayan, Abdulaziz H; Yang, Quansan; Zeng, Liangsong; Lu, Di; Koo, Jahyun; Bai, Wubin; Song, Enming; Yao, Shenglian; Wolverton, Chris; Huang, Yonggang; Rogers, John A.
Afiliación
  • Hu Z; Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.
  • Zhao J; State Key Laboratory of Molecular Engineering of Polymers, Department of Materials Science, Fudan University, Shanghai, 200433, China.
  • Guo H; Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.
  • Li R; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA.
  • Wu M; State Key Laboratory of Structural Analysis, Optimization and CAE Software for Industrial Equipment, Department of Engineering Mechanics, and International Research Center for Computational Mechanics, Dalian University of Technology, Dalian, 116024, P. R. China.
  • Shen J; Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.
  • Wang Y; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA.
  • Qiao Z; Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.
  • Xu Y; Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA.
  • Haugstad G; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA.
  • An D; Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA.
  • Xie Z; Characterization Facility, University of Minnesota, 100 Union St. SE, Minneapolis, MN, 55455, USA.
  • Kandela I; State Key Laboratory of Structural Analysis, Optimization and CAE Software for Industrial Equipment, Department of Engineering Mechanics, and International Research Center for Computational Mechanics, Dalian University of Technology, Dalian, 116024, P. R. China.
  • Nandoliya KR; State Key Laboratory of Structural Analysis, Optimization and CAE Software for Industrial Equipment, Department of Engineering Mechanics, and International Research Center for Computational Mechanics, Dalian University of Technology, Dalian, 116024, P. R. China.
  • Chen Y; Center for Developmental Therapeutics, Northwestern University, Evanston, IL, 60208, USA.
  • Yu Y; Chemistry Life Processes Institute, Northwestern University, Evanston, IL, 60208, USA.
  • Yuan Q; Department of Neurological Surgery, Northwestern University Feinberg School of Medicine, Chicago, IL, 60611, USA.
  • Hou J; School of Physical Science and Technology, Shanghai Tech University, Shanghai, 201210, China.
  • Deng Y; School of Physical Science and Technology, Shanghai Tech University, Shanghai, 201210, China.
  • AlDubayan AH; State Key Laboratory of Molecular Engineering of Polymers, Department of Materials Science, Fudan University, Shanghai, 200433, China.
  • Yang Q; State Key Laboratory of Molecular Engineering of Polymers, Department of Materials Science, Fudan University, Shanghai, 200433, China.
  • Zeng L; State Key Laboratory of Mechanical System and Vibration, Shanghai Jiao Tong University, Shanghai, 200240, China.
  • Lu D; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA.
  • Koo J; Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA.
  • Bai W; Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA.
  • Song E; Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.
  • Yao S; Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.
  • Wolverton C; Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.
  • Huang Y; Institute of Optoelectronics, Fudan University, Shanghai, 200433, P. R. China.
  • Rogers JA; Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.
Adv Mater ; 36(15): e2307782, 2024 Apr.
Article en En | MEDLINE | ID: mdl-38303684
ABSTRACT
Bio/ecoresorbable electronic systems create unique opportunities in implantable medical devices that serve a need over a finite time period and then disappear naturally to eliminate the need for extraction surgeries. A critical challenge in the development of this type of technology is in materials that can serve as thin, stable barriers to surrounding ground water or biofluids, yet ultimately dissolve completely to benign end products. This paper describes a class of inorganic material (silicon oxynitride, SiON) that can be formed in thin films by plasma-enhanced chemical vapor deposition for this purpose. In vitro studies suggest that SiON and its dissolution products are biocompatible, indicating the potential for its use in implantable devices. A facile process to fabricate flexible, wafer-scale multilayer films bypasses limitations associated with the mechanical fragility of inorganic thin films. Systematic computational, analytical, and experimental studies highlight the essential materials aspects. Demonstrations in wireless light-emitting diodes both in vitro and in vivo illustrate the practical use of these materials strategies. The ability to select degradation rates and water permeability through fine tuning of chemical compositions and thicknesses provides the opportunity to obtain a range of functional lifetimes to meet different application requirements.
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Texto completo: 1 Base de datos: MEDLINE Asunto principal: Implantes Absorbibles / Electrónica Idioma: En Revista: Adv Mater Asunto de la revista: BIOFISICA / QUIMICA Año: 2024 Tipo del documento: Article

Texto completo: 1 Base de datos: MEDLINE Asunto principal: Implantes Absorbibles / Electrónica Idioma: En Revista: Adv Mater Asunto de la revista: BIOFISICA / QUIMICA Año: 2024 Tipo del documento: Article