RESUMO
An amino-functionalized conjugated metallopolymer PFEN-Hg was developed as a cathode interlayer for inverted polymer solar cells. The resulting devices exhibited significantly improved performance with power conversion efficiencies exceeding 9%. Moreover, good device performance was achievable with the PFEN-Hg over a wider range of film thickness, likely due to the Hg-Hg interactions and improved π-π stacking.
Assuntos
Fontes de Energia Elétrica , Mercúrio/química , Compostos Organometálicos/química , Polímeros/química , Energia Solar , Eletrodos , Estrutura Molecular , Compostos Organometálicos/síntese químicaRESUMO
Pyroelectric crystals are used as a conformal and detachable electric field source to efficiently pole electro-optic (E-O) polymers in both parallel-plate (transverse) and in-plane (quasi-longitudinal) configurations. Large Pockels coefficients in poled thin films and high tunability of resonance wavelength shift in hybrid polymer silicon slot waveguide ring-resonator modulators have been achieved using this method.
Assuntos
Eletricidade , Fenômenos Ópticos , Silício/química , Polímeros/químicaRESUMO
We study the top surface composition of blends of the conjugated polymer regioregular poly-3-hexylthiophene (P3HT) with the fullerene (6,6)-phenyl-C(61)-butyric acid methyl ester (PCBM), an important model system for organic photovoltaics (OPVs), using near-edge X-ray absorption fine structure spectroscopy (NEXAFS). We compare the ratio of P3HT to PCBM near the air/film interface that results from preparing blend films on two sets of substrates: (1) poly(3,4-ethylenedioxythiophene) poly(styrenesulfonate) (PEDOT:PSS) coated indium tin oxide (ITO) as is commonly used in conventional OPV structures and (2) ZnO substrates that are either unmodified or modified with a C(60)-like self-assembled monolayer, similar to those that have been recently reported in inverted OPV structures. We find that the top surface (the film/air interface) is enriched in P3HT compared to the bulk, regardless of substrate or annealing conditions, indicating that changes in device performance due to substrate modification treatments should be attributed to the buried substrate/film interface and the bulk of the film rather than the exposed film/air interface.