RESUMEN
This paper describes two platforms for autonomous sensing microsystems that are intended for deployment in chemically corrosive environments at elevated temperatures and pressures. Following the deployment period, the microsystems are retrieved, recharged, and interrogated wirelessly at close proximity. The first platform is the Michigan Micro Mote for High Temperature (M³HT), a chip stack 2.9 × 1.1 × 1.5 mm³ in size. It uses RF communications to support pre-deployment and post-retrieval functions, and it uses customized electronics to achieve ultralow power consumption, permitting the use of a chip-scale battery. The second platform is the Environmental Logging Microsystem (ELM). This system, which is 6.5 × 6.3 × 4.5 mm³ in size, uses the smallest suitable off-the-shelf electronic and battery components that are compatible with assembly on a flexible printed circuit board. Data are stored in non-volatile memory, permitting retrieval even after total power loss. Pre-deployment and post-retrieval functions are supported by optical communication. Two types of encapsulation methods are used to withstand high pressure and corrosive environments: an epoxy filled volume is used for the M³HT, and a hollow stainless-steel shell with a sapphire lid is used for both the M³HT and ELM. The encapsulated systems were successfully tested at temperature and pressure reaching 150 °C and 10,000 psi, in environments of concentrated brine, oil, and cement slurry. At elevated temperatures, the limited lifetimes of available batteries constrain the active deployment period to several hours.
RESUMEN
GaAs photovoltaics are promising candidates for indoor energy harvesting to power small-scale (≈1 mm2) electronics. This application has stringent requirements on dark current, recombination, and shunt leakage paths due to low-light conditions and small device dimensions. The power conversion efficiency and the limiting mechanisms in GaAs photovoltaic cells under indoor lighting conditions are studied experimentally. Voltage is limited by generation-recombination dark current attributed to perimeter sidewall surface recombination based on the measurements of variable cell area. Bulk and perimeter recombination coefficients of 1.464 pA/mm2 and 0.2816 pA/mm, respectively, were extracted from dark current measurements. Resulting power conversion efficiency is strongly dependent on cell area, where current GaAs of 1-mm2 indoor photovoltaic cells demonstrates power conversion efficiency of approximately 19% at 580 lx of white LED illumination. Reductions in both bulk and perimeter sidewall recombination are required to increase maximum efficiency (while maintaining small cell area near 1 mm2) to approach the theoretical power conversion efficiency of 40% for GaAs cells under typical indoor lighting conditions.
RESUMEN
This paper presents a complete, autonomous, wireless temperature sensor, fully encapsulated in a 10.6mm3 volume. The sensor includes solar energy harvesting with an integrated 2 µAh battery, optical receiver for programming, microcontroller and memory, 8GHz UWB transmitter, and miniaturized custom antennas with a wireless range of 7 meters. Full, stand-alone operation was demonstrated for the first time for a system of this size and functionality.
RESUMEN
As we show in this paper, I/O has become the limiting factor in scaling down size and power toward the goal of invisible computing. Achieving this goal will require composing optimized and specialized-yet reusable-components with an interconnect that permits tiny, ultra-low power systems. In contrast to today's interconnects which are limited by power-hungry pull-ups or high-overhead chip-select lines, our approach provides a superset of common bus features but at lower power, with fixed area and pin count, using fully synthesizable logic, and with surprisingly low protocol overhead. We present MBus, a new 4-pin, 22.6 pJ/bit/chip chip-to-chip interconnect made of two "shoot-through" rings. MBus facilitates ultra-low power system operation by implementing automatic power-gating of each chip in the system, easing the integration of active, inactive, and activating circuits on a single die. In addition, we introduce a new bus primitive: power oblivious communication, which guarantees message reception regardless of the recipient's power state when a message is sent. This disentangles power management from communication, greatly simplifying the creation of viable, modular, and heterogeneous systems that operate on the order of nanowatts. To evaluate the viability, power, performance, overhead, and scalability of our design, we build both hardware and software implementations of MBus and show its seamless operation across two FPGAs and twelve custom chips from three different semiconductor processes. A three-chip, 2.2 mm3 MBus system draws 8 nW of total system standby power and uses only 22.6 pJ/bit/chip for communication. This is the lowest power for any system bus with MBus's feature set.