RESUMEN
The excellent intrinsic properties of aligned nanofibers, such as carbon nanotubes (CNTs), and their ability to be easily formed into multifunctional 3D architectures motivate their use for a variety of commercial applications, such as batteries, chemical sensors for environmental monitoring, and energy harvesting devices. While controlling nanofiber adhesion to the growth substrate is essential for bulk-scale manufacturing and device performance, experimental approaches and models to date have not addressed tuning the CNT array-substrate adhesion strength with thermal processing conditions. In this work, facile "one-pot" thermal postgrowth processing (at temperatures Tp = 700-950 °C) is used to study CNT-substrate pull-off strength for millimeter-tall aligned CNT arrays. CNT array pull-off from the flat growth substrate (Fe/Al2O3/SiO2/Si wafers) via tensile testing shows that the array fails progressively, similar to the response of brittle microfiber bundles in tension. The pull-off strength evolves nonmonotonically with Tp in three regimes, first increasing by 10 times through Tp = 800 °C due to graphitization of disordered carbon at the CNT-catalyst interface, and then decreasing back to a weak interface through Tp = 950 °C due to diffusion of the Fe catalyst into the substrate, Al2O3 crystallization, and substrate cracking. Failure is observed to occur at the CNT-catalyst interface below 750 °C, and the CNTs themselves break during pull-off after higher Tp processing, leaving residual CNTs on the substrate. Morphological and chemical analyses indicate that the Fe catalyst remains on the substrate after pull-off in all regimes. This work provides new insights into the interfacial interactions responsible for nanofiber-substrate adhesion and allows tuning to increase or decrease array strength for applications such as advanced sensors, energy devices, and nanoelectromechanical systems (NEMS).