>30 MW peak power from distributed face cooling tiny integrated laser.
Opt Express
; 27(21): 30217-30224, 2019 Oct 14.
Article
en En
| MEDLINE
| ID: mdl-31684271
ABSTRACT
The Distributed Face Cooling (DFC) chip was fabricated from four pieces of 1 mm-length NdYAG plate sandwiched in four pieces of sapphire heat spreaders through advanced surface activated bonding (SAB) at room temperature. A sub-nanosecond (665.7ps) pulsed DFC-chip tiny integrated laser was achieved with output energy of 21.5 mJ and peak power of 32.3 MW with saturable absorber Cr4+YAG. By finite element analysis, we confirmed the advantages of heat dissipation from DFC-chip compared with conventional bulk-chip. The SAB-DFC-chip based ubiquitous high peak power tiny integrated laser was experimentally within reach for laser-armed robot.
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MEDLINE
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En
Revista:
Opt Express
Asunto de la revista:
OFTALMOLOGIA
Año:
2019
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Article