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A Nickel Dissolution Process for Multilayer Electroforming to Achieve Ultrahigh Adhesion Strength.
Wang, Zhuangzhuang; Shen, Chunjian; Ma, Zhou; Zhu, Zengwei; Zhu, Di.
Afiliación
  • Wang Z; College of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Yudao Street 29, Nanjing 210016, China.
  • Shen C; College of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Yudao Street 29, Nanjing 210016, China.
  • Ma Z; College of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Yudao Street 29, Nanjing 210016, China.
  • Zhu Z; College of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Yudao Street 29, Nanjing 210016, China.
  • Zhu D; College of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Yudao Street 29, Nanjing 210016, China.
Materials (Basel) ; 16(19)2023 Sep 30.
Article en En | MEDLINE | ID: mdl-37834642
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Texto completo: 1 Banco de datos: MEDLINE Idioma: En Revista: Materials (Basel) Año: 2023 Tipo del documento: Article País de afiliación: China
Texto completo
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PubMed Links
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Texto completo: 1 Banco de datos: MEDLINE Idioma: En Revista: Materials (Basel) Año: 2023 Tipo del documento: Article País de afiliación: China