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Bioresorbable Multilayer Organic-Inorganic Films for Bioelectronic Systems.
Hu, Ziying; Guo, Hexia; An, Dongqi; Wu, Mingzheng; Kaura, Anika; Oh, Hannah; Wang, Yue; Zhao, Mengjia; Li, Shuo; Yang, Quansan; Ji, Xudong; Li, Shupeng; Wang, Bo; Yoo, Davin; Tran, Phuong; Ghoreishi-Haack, Nayereh; Kozorovitskiy, Yevgenia; Huang, Yonggang; Li, Rui; Rogers, John A.
Afiliación
  • Hu Z; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.
  • Guo H; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.
  • An D; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA.
  • Wu M; State Key Laboratory of Structural Analysis, Optimization and CAE Software for Industrial Equipment, Department of Engineering Mechanics, and International Research Center for Computational Mechanics, Dalian University of Technology, Dalian, 116024, P. R. China.
  • Kaura A; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.
  • Oh H; Department of Neurobiology, Northwestern University, Evanston, IL, 60208, USA.
  • Wang Y; Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA.
  • Zhao M; Department of Neurobiology, Northwestern University, Evanston, IL, 60208, USA.
  • Li S; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.
  • Yang Q; Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA.
  • Ji X; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA.
  • Li S; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.
  • Wang B; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.
  • Yoo D; Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA.
  • Tran P; Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA.
  • Ghoreishi-Haack N; Simpson Querrey Institute, Northwestern University, Chicago, IL, 60611, USA.
  • Kozorovitskiy Y; Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA.
  • Huang Y; State Key Laboratory of Structural Analysis, Optimization and CAE Software for Industrial Equipment, Department of Engineering Mechanics, and International Research Center for Computational Mechanics, Dalian University of Technology, Dalian, 116024, P. R. China.
  • Li R; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA.
  • Rogers JA; Developmental Therapeutics Core, Northwestern University, Evanston, IL, 60208, USA.
Adv Mater ; 36(19): e2309421, 2024 May.
Article en En | MEDLINE | ID: mdl-38339983
ABSTRACT
Bioresorbable electronic devices as temporary biomedical implants represent an emerging class of technology relevant to a range of patient conditions currently addressed with technologies that require surgical explantation after a desired period of use. Obtaining reliable performance and favorable degradation behavior demands materials that can serve as biofluid barriers in encapsulating structures that avoid premature degradation of active electronic components. Here, this work presents a materials design that addresses this need, with properties in water impermeability, mechanical flexibility, and processability that are superior to alternatives. The approach uses multilayer assemblies of alternating films of polyanhydride and silicon oxynitride formed by spin-coating and plasma-enhanced chemical vapor deposition , respectively. Experimental and theoretical studies investigate the effects of material composition and multilayer structure on water barrier performance, water distribution, and degradation behavior. Demonstrations with inductor-capacitor circuits, wireless power transfer systems, and wireless optoelectronic devices illustrate the performance of this materials system as a bioresorbable encapsulating structure.
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Texto completo: 1 Banco de datos: MEDLINE Asunto principal: Electrónica Idioma: En Revista: Adv Mater Asunto de la revista: BIOFISICA / QUIMICA Año: 2024 Tipo del documento: Article País de afiliación: Estados Unidos

Texto completo: 1 Banco de datos: MEDLINE Asunto principal: Electrónica Idioma: En Revista: Adv Mater Asunto de la revista: BIOFISICA / QUIMICA Año: 2024 Tipo del documento: Article País de afiliación: Estados Unidos