Design and 3D Electrical Simulations for a Controllable Equal-Gap Large-Area Silicon Drift Detector.

In this study, a controllable equal-gap large-area silicon drift detector (L-SDD) is designed. The surface leakage current is reduced by reducing the SiO2-Si interface through the new controllable equal-gap design. The design of the equal gap also solves the problem whereby the gap widens due to the larger detector size in the previous SDD design, which leads to a large invalid area of the detector. In this paper, a spiral hexagonal equal-gap L-SDD of 1 cm radius is selected for design calculation, and we implement 3D modeling and simulation of the device. The simulation results show that the internal potential gradient distribution of the L-SDD is uniform and forms a drift electric field, with the direction of electron drift pointing towards the collecting anode. The L-SDD has an excellent electron drift channel inside, and this article also analyzes the electrical performance of the drift channel to verify the correctness of the design method of the L-SDD.

Optimal Design of Multiple Floating Rings for 3D Large-Area Trench Electrode Silicon Detector.

The 3D electrode silicon detector eliminates the limit of chip thickness, so it can reduce the electrode spacing (small area) and effectively improve the radiation hardness. In order to expand the application range of the 3D electrode detector, we first propose a 3D large-area silicon detector with a large sensitive volume, and realize multiple floating rings on the upper and lower surfaces of the detector. Due to the influence of different charge states and energy levels in the Si-SiO2 interface system, the top and bottom of the 3D P+ electrode are more prone to avalanche breakdown in the 3D large-area detector before the detector is completely depleted or the carrier saturation drift velocity is reached. Moreover, the electric field distribution becomes very uneven under the influence of the oxide charge, resulting in non-equilibrium carriers that cannot drift in the optimal path parallel to the detector surface. In this paper, the effect of floating rings on the performance of a 3D large-area silicon detector is studied by TCAD simulation. It can increase avalanche breakdown voltage by 14 times in a non-irradiated environment, and can work safely in a moderate irradiated environment. The charge collection efficiency can be effectively improved by optimizing the drift path.

3D Simulation, Electrical Characteristics and Customized Manufacturing Method for a Hemispherical Electrode Detector.

The theoretical basis of a hypothetical spherical electrode detector was investigated in our previous work. It was found that the proposed detector has very good electrical characteristics, such as greatly reduced full depletion voltage, small capacitance and ultra-fast collection time. However, due to the limitations of current technology, spherical electrode detectors cannot be made. Therefore, in order to use existing CMOS technology to realize the fabrication of the detector, a hemispherical electrode detector is proposed. In this work, 3D modeling and simulation including potential and electric field distribution and hole concentration distribution are carried out using the TCAD simulation tools. In addition, the electrical characteristics, such as I-V, C-V, induced current and charge collection efficiency (CCE) with different radiation fluences, are studied to predict the radiation hardness property of the device. Furthermore, a customized manufacturing method is proposed and simulated with the TCAD-SPROCESS simulation tool. The key is to reasonably set the aspect ratio of the deep trench in the multi-step repetitive process and optimize parameters such as the angle, energy, and dose of ion implantation to realize the connection of the heavily doped region of the near-hemispherical electrode. Finally, the electrical characteristics of the process simulation are compared with the device simulation results to verify its feasibility.

Identification and functional analysis of cytochrome P450 CYP346 family genes associated with phosphine resistance in Tribolium castaneum.

Resistance to phosphine fumigation has been frequently reported in insect pests of stored products and remains one of the obstacles in controlling these pests, including Tribolium castaneum. In this study, six field populations of T. castaneum were collected from different localities in China. Bioassay data showed that SZ population was strongly resistant to phosphine, followed by moderate-resistance populations WL and SF and three susceptible populations JX, YN, and ML. In addition, synergism assays showed that piperonyl butoxide significantly increased the toxicity of phosphine in resistant population SZ. Furthermore, CYP346B subfamily genes, CYP346B1, CYP346B2, and CYP346B3, were significantly overexpressed in resistant populations. Expression of CYP346B1, CYP346B2, and CYP346B3 were significantly upregulated following exposure to phosphine. RNAi assays showed that depletions on the expression levels of CYP346B1, CYP346B2, and CYP346B3 resulted in an increase of susceptibility to phosphine in T. castaneum, respectively. Our data demonstrated that CYP346B subfamily genes in T. castaneum were associated with the resistance of phosphine. Moreover, the study also increased our understanding of the molecular basis of phosphine resistance in stored pest insects.

Design and Simulated Electrical Properties of a Proposed Implanted-Epi Silicon 3D-Spherical Electrode Detector.

A new type of 3D electrode detector, named here as the Implanted-Epi Silicon 3D-Spherical Electrode Detector, is proposed in this work. Epitaxial and ion implantation processes can be used in this new detector, allowing bowl-shaped electrodes to penetrate the silicon completely. The distance between the bowl cathode and the central collection electrode is basically the same, thus the total depletion voltage of Implanted-Epi Silicon 3D-Spherical Electrode Detectors is no longer directively correlated with the thickness of the silicon wafer, but only related to the electrode spacing. In this work, we model the device physics of this new structure and use a simulation program to conduct a systematic 3D simulation of its electrical characteristics, including electric potential and electric field distributions, electron concentration profile, leakage current, and capacitance, and compare it to the traditional 3D detectors. The theoretical and simulation study found that the internal electric potential of the new detector was smooth and no potential saddle point was found. The electric field is also uniform, and there is no zero field and a low electric field area. Compared with the traditional silicon 3D electrode detectors, the full depletion voltage is greatly reduced and the charge collection efficiency is improved. As a large electrode spacing (up to 500 µm) can be realized in the Implanted-Epi Silicon 3D-Spherical Electrode Detector thanks to their advantage of a greatly reduced full depletion voltage, detectors with large pixel cells (and thus small dead volume) can be developed for applications in photon science (X-ray, among others).

Optimized Design of a Hexagonal Equal Gap Silicon Drift Detector with Arbitrary Surface Electric Field Spiral.

In our previous studies, the silicon drift detector (SDD) structure with a constant spiral ring cathode gap (g) and a given surface electric field has been partially investigated based on the physical model that gives an analytical solution to the integrals in the calculations. Those results show that the detector has excellent electrical characteristics with a very homogeneous carrier drift electric field. In order to cope with the implementation of the theoretical approach with a complete set of technical parameters, this paper performs different theoretical algorithms for the technical implementation of the detector performance using the Taylor expansion method to construct a model for cases where the parameter "j" is a non-integer, approximating the solution with finite terms. To verify the accuracy of this situation, we performed a simulation of the relevant electrical properties using the Sentaurus TCAD tool 2018. The electrical properties of the single and double-sided detectors are first compared, and then the effects of different equal gaps g (g = 10 µm, 20 µm, and 25 µm, respectively) on the electrical properties of the double-sided detectors are analyzed and demonstrated. By analyzing and comparing the electrical characteristics data from the simulation results, we can show that the double-sided structure has a larger transverse drift electric field, which improves the spatial position resolution as well as the response speed. The effect of the gap size on the electrical characteristics of the detector is also analyzed by analyzing three different gap bifacial detectors, and the results show that a 10 µm equal gap is the optimal design. Such results can be used in applications requiring large-area SDD, such as the pulsar X-ray autonomous navigation. in the future to provide navigation and positioning space services for spacecraft deep-space exploration.

Novel Spiral Silicon Drift Detector with Equal Cathode Ring Gap and Given Surface Electric Fields.

Since the advent of semiconductor detectors, they have been developed for several generations, and their performance has been continuously improved. In this paper, we propose a new silicon drift detector structure that is different from the traditional spiral SDD structure that has a gap between the cathode ring and the width of cathode ring, increasing gradually with the increase of the radius of the cathode ring. Our new structure of spiral SDD structure has equal cathode ring gap and a given surface electric field, which has many advantages compared with the traditional structure. The novel SDD structure controllably reduces the area of silicon oxide between the spiral rings, which in turn reduces the surface leakage current due to the reduction of total oxide charge in the silicon oxide and electronic states on the silicon/silicon oxide interface. Moreover, it has better controllability to adjust this spiral ring cathode gap to achieve better surface electric field distribution, thus realizing the optimal carrier drift electric field and achieving the optimal detector performance. In order to verify this theory, we have modeled this new structure and simulated its electrical properties using the Sentaurus TCAD tool. We have also analyzed and compared different spiral ring cathode gap structures (from 10 µm to 25 µm for the gap). According to the simulation results of potential, electric field, and electron concentration, we have obtained that a spiral ring cathode gap of 10 µm has the best electrical characteristics, more uniform distribution of potential and surface electric field, and a more smooth and straight electron drift channel.

Radiation Hardness Property of Ultra-Fast 3D-Trench Electrode Silicon Detector on N-Type Substrate.

The radiation fluence of high luminosity LHC (HL-LHC) is predicted up to 1 × 1016 1 MeV neq/cm2 in the ATLAS and CMS experiments for the pixel detectors at the innermost layers. The increased radiation leads to the degradation of the detector properties, such as increased leakage current and full depletion voltage, and reduced signals and charge collection efficiency, which means it is necessary to develop the radiation hard semiconductor devices for very high luminosity colliders. In our previous study about ultra-fast 3D-trench electrode silicon detectors, through induced transient current simulation with different minimum ionizing particle (MIP) hitting positions, the ultra-fast response times ranging from 30 ps to 140 ps were verified. In this work, the full depletion voltage, breakdown voltage, leakage current, capacitance, weighting field and MIP induced transient current (signal) of the detector after radiation at different fluences will be simulated and calculated with professional software, namely the finite-element Technology Computer-Aided Design (TCAD) software frameworks. From analysis of the simulation results, one can predict the performance of the detector in heavy radiation environment. The fabrication of pixel detectors will be carried out in CMOS process platform of IMECAS based on ultra-pure high resistivity (up to 104 ohm·cm) silicon material.

A Near-Infrared CMOS Silicon Avalanche Photodetector with Ultra-Low Temperature Coefficient of Breakdown Voltage.

Silicon avalanche photodetector (APD) plays a very important role in near-infrared light detection due to its linear controllable gain and attractive manufacturing cost. In this paper, a silicon APD with punch-through structure is designed and fabricated by standard 0.5 µm complementary metal oxide semiconductor (CMOS) technology. The proposed structure eliminates the requirements for wafer-thinning and the double-side metallization process by most commercial Si APD products. The fabricated device shows very low level dark current of several tens Picoamperes and ultra-high multiplication gain of ~4600 at near-infrared wavelength. The ultra-low extracted temperature coefficient of the breakdown voltage is 0.077 V/K. The high performance provides a promising solution for near-infrared weak light detection.

Electrical Properties of Ultra-Fast 3D-Trench Electrode Silicon Detector.

In our previous work on ultra-fast silicon detectors, extremely small carrier drift times of 50-100 picoseconds were predicted for electrode spacing of 5-10 µm. Expanding on these previous works, we systematically study the electrical characteristics of the ultra-fast, 3D-trench electrode silicon detector cell with p-type bulk silicon, such as electric potential distribution, electric field distribution, hole concentration distribution, and leakage current to analyze the full detector depletion voltage and other detector properties. To verify the prediction of ultra-fast response times, we simulate the instant induced current curves before and after irradiation with different minimum ionizing particle (MIP) hitting positions. High position resolution pixel detectors can be fabricated by constructing an array of these extremely small detector cells.