RESUMEN
Multi-view microscopic fringe projection systems, which use high-resolution telecentric lenses and the Scheimpflug condition, face challenges in coinciding focal planes accurately, resulting in inconsistent measurements between views. In this Letter, we developed a sharpness evaluation function based on the total power of the line-spread function, which was subsequently used to generate a full-field sharpness distribution map. Then we employed the correlation between the sharpness map and orientation of the focal plane to precisely coincide the focal planes. Experimental results validate the proposed method and demonstrate its improved consistency in 3D reconstruction.
RESUMEN
Cu pillars serve as interconnecting structures for 3D chip stacking in heterogeneous integration, whose height uniformity directly impacts chip yield. Compared to typical methods such as white-light interferometry and confocal microscopy for measuring Cu pillars, microscopic fringe projection profilometry (MFPP) offers obvious advantages in throughput, which has great application value in on-line bump height measurement in wafer-level packages. However, Cu pillars with large curvature and smooth surfaces pose challenges for signal detection. To enable the MFPP system to measure both the top region of the Cu pillar and the substrate, which are necessary for bump height measurement, we utilized rigorous surface scattering theory to solve the bidirectional reflective distribution function of the Cu pillar surface. Subsequently, leveraging the scattering distribution properties, we propose a hybrid bright-dark-field MFPP system concept capable of detecting weakly scattered signals from the top of the Cu pillar and reflected signals from the substrate. Experimental results demonstrate that the proposed MFPP system can measure the height of Cu pillars with an effective field of view of 15.2 mm × 8.9 mm and a maximum measurement error of less than 0.65 µm.
RESUMEN
In microscopic fringe projection profilometry (MFPP), the traditional absolute phase retrieval method using composite frequency fringe has the shortcomings of low accuracy and poor robustness due to mutual crosstalk of harmonic from the different channels of frequency-division multiplexing. In this study, an absolute phase retrieval method that avoids the inter-channel crosstalk is proposed. By introducing guard bands to accommodate the frequency channels corresponding to the second harmonic that dominate the high order harmonics, the aliasing between the second harmonic and the fundamental is eliminated. Consequently, phase maps without crosstalk can be demodulated using appropriate phase-shifting algorithms. The proposed method is well-suited for high-precision three-dimensional shape measurement scenarios in many fields such as integrated circuit manufacturing process control and micro-electro-mechanical system quality inspection. The experiment results demonstrate that the anti-crosstalk method is effective and can realize three-dimensional reconstruction for discontinuous planar surface and spherical surface.
RESUMEN
As the electronic interconnection between chips, microbumps are crucial components in advanced packaging for the demand of better performance and higher packaging density. The height and coplanarity of microbumps are critical to ensure the reliability of connections. The poor uniformity in bump height will lead to disconnect or insufficient contact, which will directly result in the failure of the chip's function and a lower yield rate. In this paper, we proposed a height measurement method of microbumps using white-light triangulation combined with geometrical characteristics of bumps. A linear light projection module composed of a lens group and LED light source was set up as well as a high-quality imaging module consisting of a CCD camera and microscope objective group. The projection and imaging model of microbumps illuminated by the light plane at different positions during the scanning process was analyzed. The microbump height is computed from a simple formula based on the geometry of the specimen and the system configuration. The measurement results are compared with that obtained from a commercial optical profiler, and the measurement uncertainty is analyzed in detail.