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Research on a 3D Encapsulation Technique for Capacitive MEMS Sensors Based on Through Silicon Via.
Zhang, Meng; Yang, Jian; He, Yurong; Yang, Fan; Yang, Fuhua; Han, Guowei; Si, Chaowei; Ning, Jin.
Affiliation
  • Zhang M; Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China. zhangmeng@semi.ac.cn.
  • Yang J; College of Materials Science and Opto-Electronic Technology, University of Chinese Academy of Sciences, Beijing 100049, China. zhangmeng@semi.ac.cn.
  • He Y; Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China. yangjian@semi.ac.cn.
  • Yang F; College of Materials Science and Opto-Electronic Technology, University of Chinese Academy of Sciences, Beijing 100049, China. yangjian@semi.ac.cn.
  • Yang F; College of Materials Science and Opto-Electronic Technology, University of Chinese Academy of Sciences, Beijing 100049, China. hyr617@semi.ac.cn.
  • Han G; Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China. yangfan3104@semi.ac.cn.
  • Si C; College of Materials Science and Opto-Electronic Technology, University of Chinese Academy of Sciences, Beijing 100049, China. yangfan3104@semi.ac.cn.
  • Ning J; Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China. fhyang@semi.ac.cn.
Sensors (Basel) ; 19(1)2018 Dec 28.
Article in En | MEDLINE | ID: mdl-30597879
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Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Sensors (Basel) Year: 2018 Type: Article Affiliation country: China
Fulltext
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PubMed Links
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Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Sensors (Basel) Year: 2018 Type: Article Affiliation country: China