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An implantable wireless tactile sensing system.
Du, Lin; Hao, Han; Ding, Yixiao; Gabros, Andrew; Mier, Thomas C E; Van der Spiegel, Jan; Lucas, Timothy H; Aflatouni, Firooz; Richardson, Andrew G; Allen, Mark G.
Affiliation
  • Du L; Department of Electrical and Systems Engineering, School of Engineering and Applied Science, University of Pennsylvania, Philadelphia, PA 19104, USA.
  • Hao H; Department of Neurosurgery, Perelman School of Medicine, University of Pennsylvania, Philadelphia, PA 19104, USA.
  • Ding Y; Department of Electrical and Systems Engineering, School of Engineering and Applied Science, University of Pennsylvania, Philadelphia, PA 19104, USA.
  • Gabros A; Department of Electrical and Systems Engineering, School of Engineering and Applied Science, University of Pennsylvania, Philadelphia, PA 19104, USA.
  • Mier TCE; Department of Neurosurgery, Perelman School of Medicine, University of Pennsylvania, Philadelphia, PA 19104, USA.
  • Van der Spiegel J; Department of Electrical and Systems Engineering, School of Engineering and Applied Science, University of Pennsylvania, Philadelphia, PA 19104, USA.
  • Lucas TH; Department of Electrical and Systems Engineering, School of Engineering and Applied Science, University of Pennsylvania, Philadelphia, PA 19104, USA.
  • Aflatouni F; Departments of Neurosurgery and Biomedical Engineering, The Ohio State University, Columbus, OH 43210, USA.
  • Richardson AG; Department of Electrical and Systems Engineering, School of Engineering and Applied Science, University of Pennsylvania, Philadelphia, PA 19104, USA.
  • Allen MG; Department of Neurosurgery, Perelman School of Medicine, University of Pennsylvania, Philadelphia, PA 19104, USA.
Res Sq ; 2023 Feb 03.
Article in En | MEDLINE | ID: mdl-36778258

Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Res Sq Year: 2023 Type: Article Affiliation country: United States

Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Res Sq Year: 2023 Type: Article Affiliation country: United States