Kirigami-based metastructures with programmable multistability.

SignificanceDifferent from most existing multistable structures whose multiple stable states are achieved through the combinational effect of bistable units, we invent a generic tristable kirigami cuboid. The three stable states have fundamentally distinct geometric configurations and chirality, and the transformation among them can be realized by tension/compression or clockwise/counterclockwise twist. Tessellating the units in series, a family of multistable metamaterials can be constructed, the mechanical behaviors of which are programmable by the unit geometry, the material of the elastic joints, the number of units, and the loading conditions. As a demonstration of the potential applications, a frequency reconfigurable antenna for 5G triple-band communication is developed based on a tristable unit, and the frequency tunability is verified by experiments.

Reliability Evaluation for Continuous-Wave Functional Near-Infrared Spectroscopy Systems: Comprehensive Testing from Bench Characterization to Human Test.

In recent years, biomedical optics technology has developed rapidly. The current widespread use of biomedical optics was made possible by the invention of optical instruments. The advantages of being non-invasive, portable, effective, low cost, and less susceptible to system noise have led to the rapid development of functional near-infrared spectroscopy (fNIRS) technology for hemodynamics detection, especially in the field of functional brain imaging. At the same time, laboratories and companies have developed various fNIRS-based systems. The safety, stability, and efficacy of fNIRS systems are key performance indicators. However, there is still a lack of comprehensive and systematic evaluation methods for fNIRS instruments. This study uses the fNIRS system developed in our laboratory as the test object. The test method established in this study includes system validation and performance testing to comprehensively assess fNIRS systems' reliability. These methods feature low cost and high practicality. Based on this study, existing or newly developed systems can be comprehensively and easily evaluated in the laboratory or workspace.

A 24-to-30 GHz Ultra-High-Linearity Down-Conversion Mixer for 5G Applications Using a New Linearization Method.

The linearity of active mixers is usually determined by the input transistors, and many works have been proposed to improve it by modified input stages at the cost of a more complex structure or more power consumption. A new linearization method of active mixers is proposed in this paper; the input 1 dB compression point (IP1dB) and output 1 dB compression point (OP1dB) are greatly improved by exploiting the "reverse uplift" phenomenon. Compared with other linearization methods, the proposed one is simpler, more efficient, and sacrifices less conversion gain. Using this method, an ultra-high-linearity double-balanced down-conversion mixer with wide IF bandwidth is designed and fabricated in a 130 nm SiGe BiCMOS process. The proposed mixer includes a Gilbert-cell, a pair of phase-adjusting inductors, and a Marchand-balun-based output network. Under a 1.6 V supply voltage, the measurement results show that the mixer exhibits an excellent IP1dB of +7.2~+10.1 dBm, an average OP1dB of +5.4 dBm, which is the state-of-the-art linearity performance in mixers under a silicon-based process, whether active or passive. Moreover, a wide IF bandwidth of 8 GHz from 3 GHz to 11 GHz was achieved. The circuit consumes 19.8 mW and occupies 0.48 mm2, including all pads. The use of the "reverse uplift" allows us to implement high-linearity circuits more efficiently, which is helpful for the design of 5G high-speed communication transceivers.

A Study on the Reliability Evaluation of a 3D Packaging Storage Module under Temperature Cycling Ultimate Stress Conditions.

Based on the theory of reliability enhancement testing technology, this study used a variety of testing combinations and finite element simulations to analyze the stress-strain properties of 3D packaging storage modules and then evaluated its operating and destruction limits during temperature cycling tests (-65 °C~+150 °C) for the purpose of identifying the weak points and failure mechanisms affecting its reliability. As a result of temperature cycling ultimate stress, 3D packaging storage devices can suffer from thermal fatigue failure in the case of abrupt temperature changes. The cracks caused by the accumulation of plastic and creep strains can be considered the main factors. Crack formation is accelerated by the CTE difference between the epoxy resin and solder joints. Moreover, the finite element simulation results were essentially the same as the testing results, with a deviation occurring within 10%.