A next-generation transistor with low supply voltage operation constructed based on 2D materials' metal-semiconductor phase transition.

Power dissipation, a fundamental limitation for realizing high-performance electronic devices, may be effectively reduced by an external supply voltage. However, a small supply voltage simultaneously brings another serious challenge, that is, a remarkable device inability in transistors. To deal with this issue, we propose a new transistor design based on the metal-semiconductor phase transition in a AsGeC3 monolayer, which provides a switching mechanism of band-to-band tunneling at on- and off-states by gate-voltage modulation. Our first-principles calculations uncover that the monolayer AsGeC3 field-effect transistors (FETs) with gate lengths of 5, 4, and 3 nm may meet well the requirements for on-state current (Ion), power dissipation (PDP), and delay period (τ) as outlined by the International Technology Roadmap for Semiconductors (ITRS) in 2013 to achieve higher performance by the year 2028. Importantly, high performances are achieved only under a very low supply voltage (VDD = 0.05/0.10 V). Significantly, the AsGeC3 FETs exhibit remarkably lower values of both PDP and τ than those of nearly all the transistors reported up to date. These novel 2D metal-semiconductor phase transition-based FETs open up a new door for designing next-generation low-power electronic devices.

Simulations of Anisotropic Monolayer GaSCl for p-Type Sub-10 nm High-Performance and Low-Power FETs.

Two-dimensional materials have been extensively studied in field-effect transistors (FETs). However, the performance of p-type FETs has lagged behind that of n-type, which limits the development of complementary logical circuits. Here, we investigate the electronic properties and transport performance of anisotropic monolayer GaSCl for p-type FETs through first-principles calculations. The anisotropic electronic properties of monolayer GaSCl result in excellent device performance. The p-type GaSCl FETs with 10 nm channel length have an on-state current of 2351 µA/µm for high-performance (HP) devices along the y direction and an on-state current of 992 µA/µm with an on/off ratio exceeding 107 for low-power (LP) applications along the x direction. In addition, the delay-time (τ) and power dissipation product of GaSCl FETs can fully meet the International Technology Roadmap for Semiconductors standards for HP and LP applications. Our work illustrates that monolayer GaSCl is a competitive p-type channel for next-generation devices.

Identifying atomically thin isolated-band channels for intrinsic steep-slope transistors by high-throughput study.

Developing low-power FETs holds significant importance in advancing logic circuits, especially as the feature size of MOSFETs approaches sub-10 nanometers. However, this has been restricted by the thermionic limitation of SS, which is limited to 60 mV per decade at room temperature. Herein, we proposed a strategy that utilizes 2D semiconductors with an isolated-band feature as channels to realize sub-thermionic SS in MOSFETs. Through high-throughput calculations, we established a guiding principle that combines the atomic structure and orbital interaction to identify their sub-thermionic transport potential. This guides us to screen 192 candidates from the 2D material database comprising 1608 systems. Additionally, the physical relationship between the sub-thermionic transport performances and electronic structures is further revealed, which enables us to predict 15 systems with promising device performances for low-power applications with supply voltage below 0.5 V. This work opens a new way for the low-power electronics based on 2D materials and would inspire extensive interests in the experimental exploration of intrinsic steep-slope MOSFETs.

High-Performance Sub-10 nm Two-Dimensional SbSeBr Transistors through Transport Orientation.

Exploring two-dimensional (2D) materials with a small carrier effective mass and suitable band gap is crucial for the design of metal oxide semiconductor field effect transistors (MOSFETs). Here, the quantum transport properties of stable 2D SbSeBr are simulated on the basis of first-principles calculations. Monolayer SbSeBr proves to be a competitive channel material, offering a suitable band gap of 1.18 eV and a small electron effective mass (me*) of 0.22m0. The 2D SbSeBr field effect transistor (FET) with 8 nm channel length exhibits a high on-state current of 1869 µA/µm, low power consumption of 0.080 fJ/µm, and small delay time of 0.062 ps, which can satisfy the requirements of the International Technology Roadmap for Semiconductors for high-performance devices. Moreover, despite the monolayer SbSeBr having an isotropic me*, the asymmetrical band trends enable SbSeBr FETs to display transport orientation, which emphasizes the importance of band trends and provides valuable insights for selecting channel materials.

High-Performance and Low-Power p-Channel Transistors Based on Monolayer Be2C.

The advantages of 2D materials in alleviating the issues of short-channel effect and power dissipation in field-effect transistors (FETs) are well recognized. However, the progress of complementary integrated circuits has been stymied by the absence of high-performance (HP) and low-power (LP) p-channel transistors. Therefore, we conducted an investigation into the electronic and ballistic transport characteristics of monolayer Be2C, which features quasi-planar hexacoordinate carbons, by employing nonequilibrium Green's function combined with density functional theory. Be2C monolayer has planar anticonventional bonds and a direct bandgap of 1.53 eV. The Ion of p-type Be2C HP FETs can achieve a remarkable 2767 µA µm-1. All of the device properties of 2D Be2C FETs can exceed the demands of the International Roadmap for Devices and Systems. The excellent properties of Be2C as a 2D p-orbital material with a high hole mobility are discussed from different aspects. Our findings thus illustrate the tremendous potential of 2D Be2C for the next generation of HP and LP electronics applications.

High-performance monolayer Na3Sb shrinking transistors: a DFT-NEGF study.

2D materials with direct bandgaps and high carrier mobility are considered excellent candidates for next-generation electronic and optoelectronic devices. Here, a new 2D semiconductor, Na3Sb, is proposed and investigated for the performance limits of FETs by ab initio quantum-transport simulations. Monolayer Na3Sb shows a direct bandgap of 0.89 eV and a high phonon-limited electron mobility of up to 1.25 × 103 cm2 V-1 s-1. We evaluated the impact of channel lengths, gate underlaps, oxide thicknesses, and dielectrics on devices. The major figures of merits for FETs are also assessed in terms of the On-Off ratio, subthreshold swing, gate capacitance, delay time, power dissipation, and field-effect mobility, fulfilling the requirements of the International Roadmap for Devices and Systems (IRDS) for high-performance (HP) devices and demonstrating great potential for electronics with novel 2D Na3Sb.

DFT coupled with NEGF study of the electronic properties and ballistic transport performances of 2D SbSiTe3.

Identifying novel 2D semiconductors with promising electronic properties and transport performances for the development of electronic and optoelectronic applications is of utmost importance. Here, we show a detailed study of the electronic properties and ballistic quantum transport performance of a new 2D semiconductor, SbSiTe3, based on density functional theory (DFT) and non-equilibrium Green's function (NEGF) formalism. Promisingly, monolayer SbSiTe3 owns an indirect band gap of 1.61 eV with a light electron effective mass (0.13m0) and an anisotropic hole effective mass (0.49m0 and 1.34m0). The ballistic performance simulations indicate that the 10 nm monolayer SbSiTe3 n- and p-MOSFETs display a steep subthreshold swing of about 80 mV dec-1 and a high on/off ratio (106), which indicate a good gate-controlling capability. As the channel length of SbSiTe3 decreases to 5 nm, its p-MOSFET also effectively suppresses the intra-band tunneling. Therefore, 2D SbSiTe3 is a potential semiconductor for future nanoelectronics.

Electronic structure and transport properties of 2D RhTeCl: a NEGF-DFT study.

2D materials are considered as excellent candidates for next-generation electronic and optoelectronic devices. However, the corresponding systems with both an appropriate direct band gap and high carrier mobility are urgently required. Here, a new 2D semiconductor, monolayer RhTeCl, is investigated based on first-principles calculations. Monolayer RhTeCl possesses a direct band gap of 2.16 eV, with a high electron mobility up to 1.5 × 104 cm2 V-1 s-1. Thus, monolayer RhTeCl double-gated metal-oxide-semiconductor field-effect transistors (MOSFETs) with a 6 nm gate length are simulated by quantum transport methods. The 6 nm monolayer RhTeCl n-MOSFET displays a steep sub-kT/q switching characteristic and a high on/off ratio (106), which demonstrates a superior gate control. Therefore, these promising semiconductor characteristics and device performances of 2D RhTeCl provide new opportunities for novel low power ultra-scaled devices.