The thermodynamic-pathway-determined microstructure evolution of copper under shock compression.

Ling, Weidong; Chen, Bo; Zhao, Zengxiu; Chen, Kaiguo; Kang, Dongdong; Dai, Jiayu

Ling, Weidong; Chen, Bo; Zhao, Zengxiu; Chen, Kaiguo; Kang, Dongdong; Dai, Jiayu.

Afiliación

Ling W; Department of Physics, National University of Defense Technology, Changsha, Hunan 410073, People's Republic of China.
Chen B; Department of Physics, National University of Defense Technology, Changsha, Hunan 410073, People's Republic of China.
Zhao Z; Department of Physics, National University of Defense Technology, Changsha, Hunan 410073, People's Republic of China.
Chen K; Department of Physics, National University of Defense Technology, Changsha, Hunan 410073, People's Republic of China.
Kang D; Department of Physics, National University of Defense Technology, Changsha, Hunan 410073, People's Republic of China.
Dai J; Department of Physics, National University of Defense Technology, Changsha, Hunan 410073, People's Republic of China.

Philos Trans A Math Phys Eng Sci ; 381(2253): 20220210, 2023 Aug 21.

Article en En | MEDLINE | ID: mdl-37393942

Palabras clave

cold melting; non-equilibrium molecular dynamics; shock compression; thermodynamic pathway

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Texto completo: 1 Colección: 01-internacional Banco de datos: MEDLINE Idioma: En Revista: Philos Trans A Math Phys Eng Sci Asunto de la revista: BIOFISICA / ENGENHARIA BIOMEDICA Año: 2023 Tipo del documento: Article

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