Wettability of Sn-3.0Ag-0.5Cu Solder Reinforced with TiO2 and Al2O3 Nanoparticles at Different Reflow Times.

Mohamed Muzni, Nur Haslinda; Mhd Noor, Ervina Efzan; Abdullah, Mohd Mustafa Al Bakri

Wettability of Sn-3.0Ag-0.5Cu Solder Reinforced with TiO₂ and Al₂O₃ Nanoparticles at Different Reflow Times.

Mohamed Muzni, Nur Haslinda; Mhd Noor, Ervina Efzan; Abdullah, Mohd Mustafa Al Bakri.

Afiliación

Mohamed Muzni NH; Faculty of Engineering and Technology, Multimedia University, Ayer Keroh 75450, Malacca, Malaysia.
Mhd Noor EE; Faculty of Engineering and Technology, Multimedia University, Ayer Keroh 75450, Malacca, Malaysia.
Abdullah MMAB; Faculty of Chemical Engineering and Technology, Universiti Malaysia Perlis, Arau 02600, Perlis, Malaysia.

Nanomaterials (Basel) ; 13(20)2023 Oct 23.

Article en En | MEDLINE | ID: mdl-37887960

Palabras clave

nanocomposite; nanoparticles; wettability

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Texto completo: 1 Colección: 01-internacional Banco de datos: MEDLINE Idioma: En Revista: Nanomaterials (Basel) Año: 2023 Tipo del documento: Article País de afiliación: Malasia

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