RESUMEN
High in reliability, multi in function, and strong in tracking and detecting, active phased array antennas have been widely applied in radar systems. Heat dissipation is a major technological barrier preventing the realization of next-generation high-performance phased array antennas. As a result of the advancement of miniaturization and the integration of microelectronics technology, the study and development of embedded direct cooling or heat dissipation has significantly enhanced the heat dissipation effect. In this paper, a novel swept-back fishnet-embedded microchannel topology (SBFEMCT) is designed, and various microchannel models with different fishnet runner mesh density ratios and different fishnet runner layers are established to characterize the chip Tmax, runner Pmax, and Vmax and analyze the thermal effect of SBFEMCT under these two operating conditions. The Pmax is reduced to 72.37% and 57.12% of the original at mesh density ratios of 0.5, 0.25, and 0.125, respectively. The maximum temperature reduction figures are average with little change in maximum velocity and a small increase in maximum pressure drop across the number of fishnet runner layers from 0 to 4. This paper provides a study of the latest embedded thermal dissipation from the dimension of a single chip to provide a certain degree of new ideas and references for solving the thermal technology bottleneck of next-generation high-performance phased array antennas.
RESUMEN
Embedded liquid cooling is a preferred solution for dissipating the heat generated by high-power chips. The cooling capacity and pump power consumption of embedded liquid cooling heat sinks differ significantly between different structures. To achieve an accurate match between cooling capacity and heat dissipation requirements, the selection of a liquid-cooled heat sink should be carefully considered in conjunction with the heat dissipation needs of heat sources in real-world thermal management issues. Based on the manufacturing limitations on chip temperature and microchannel pressure, a composite performance index function was developed to assess the cooling capacity and cooling cost of the heat sink. This allowed for the establishment of an evaluation standard to determine the suitability of embedded liquid cooling and heat sink for the heat source. In this study, the suitability of four microchannel heat sinks with the same feature length and fin volume was evaluated under various thermal load conditions. The results show that the best-suited heat sink changes with variations in the thermal load of the chip. In the example, when the heat source was homogeneous at 100 W, the circular section pin fins have an optimal suitability of 0.928 for Re = 500. When the heat source was a heterogeneous heat source with a power of 100 W, the value of Θ was found to be 0.389. Additionally, the optimal suitability of drop section pin fins for Re = 971.5 was determined to be 0.862.
RESUMEN
Cooling is important for AlGaN/GaN high-electron mobility transistors (HEMTs) performance. In this paper, the advantages and disadvantages of the cooling performance of three cooling schemes: remote cooling (R-cool), near-chip cooling (NC-cool), and chip-embedded cooling (CE-cool) are compared. The influences of distinct geometric parameters and operating conditions on thermal resistance are investigated. The results show that the thermal resistances of NC-cool and CE-cool are almost the same as each other. Decreasing microchannel base thickness (hb) significantly increases the thermal resistance of CE-cool, and when its thickness is less than a critical value, NC-cool exhibits superior cooling performance than CE-cool. The critical thickness increases when decreasing the heat source pitch (Ph) and the convective heat transfer coefficient (hconv) or increasing the thermal conductivity of the substrate (λsub). Moreover, increasing Ph or λsub significantly improves the thermal resistance of three cooling schemes. Increasing hconv significantly decreases the thermal resistances of NC-cool and CE-cool while hardly affecting the thermal resistance of R-cool. The influence of the boundary thermal resistance (TBR) on the thermal resistance significantly increases at higher λsub and larger hconv.
RESUMEN
A numerical simulation model of embedded liquid microchannels for cooling 3D multi-core chips is established. For the thermal management problem when the operating power of a chip changes dynamically, an intelligent method combining BP neural network and genetic algorithm is used for distribution optimization of coolant flow under the condition with a fixed total mass flow rate. Firstly, a sample point dataset containing temperature field information is obtained by numerical calculation of convective heat transfer, and the constructed BP neural network is trained using these data. The "working condition-flow distribution-temperature" mapping relationship is predicted by the BP neural network. The genetic algorithm is further used to optimize the optimal flow distribution strategy to adapt to the dynamic change of power. Compared with the commonly used uniform flow distribution method, the intelligently optimized nonuniform flow distribution method can further reduce the temperature of the chip and improve the temperature uniformity of the chip.