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Unequal bonding in Ag-CuIn3Se5-based solid solutions responsible for reduction in lattice thermal conductivity and improvement in thermoelectric performance.
Cui, Jiaolin; Lu, Yufu; Chen, Shaoping; Liu, Xianglian; Du, Zhengliang.
Afiliación
  • Cui J; School of Materials & Engineering, Ningbo University of Technology Ningbo 315016 China cuijiaolin@163.com.
  • Lu Y; School of Materials & Engineering, Ningbo University of Technology Ningbo 315016 China cuijiaolin@163.com.
  • Chen S; Materials Science and Engineering College, Taiyuan University of Technology Taiyuan 030024 China.
  • Liu X; Materials Science and Engineering College, Taiyuan University of Technology Taiyuan 030024 China.
  • Du Z; School of Materials & Engineering, Ningbo University of Technology Ningbo 315016 China cuijiaolin@163.com.
RSC Adv ; 8(17): 9574-9579, 2018 Feb 28.
Article en En | MEDLINE | ID: mdl-35541853
Owing to their unique crystal and band structures, in thermoelectrics increasing attention has recently been paid to compounds of the ternary I-III-VI chalcopyrite family. In this work, unequal bonding between cation and anion pairs in Cu1-y Ag y In3Se4.9Te0.1 solid solutions, which can be effectively used to disturb phonon transport, has been proposed. The unequal bonding, which is represented by the difference of bond lengths Δd, Δd = d (Cu-Se) - d (In-Se) and anion position displacement from its equilibrium position Δu = u - 0.25, is created by the isoelectronic substitution of Ag for Cu. At y = 0.2 both the Δd and Δu values reach their maxima, resulting in a remarkable reduction in lattice thermal conductivity (κ L) and an improvement in TE performance. However, as the y value increase to 0.3 both Δd and Δu values decrease, causing the κ L value to increase and the ZT value to decrease from 0.5 to 0.24 at 930 K. Accordingly, unequal bonding might be an alternative way to improve the TE performance of ternary chalcopyrites.

Texto completo: 1 Base de datos: MEDLINE Idioma: En Revista: RSC Adv Año: 2018 Tipo del documento: Article

Texto completo: 1 Base de datos: MEDLINE Idioma: En Revista: RSC Adv Año: 2018 Tipo del documento: Article