SiO2 bridged AlN/methylphenyl silicone resin composite with integrated superior insulating property, high-temperature resistance, and high thermal conductivity.
J Colloid Interface Sci
; 661: 91-101, 2024 May.
Article
en En
| MEDLINE
| ID: mdl-38295706
ABSTRACT
A high-temperature-resistance insulating layer with high thermal conductivity is the key component for fabricating the instant metal-based electric heating tube. However, it is still a challenge for materials to possess excellent high-temperature resistance, superior insulating property, and high thermal conductivity at the same time. Here, a novel SiO2 bridged AlN/MSR composite based on methylphenyl silicone resin (MSR) and AlN filler was reported. MSR with a high thermal decomposition temperature of 452.0 °C and a high withstand voltage of 5.6 kV was first synthesized by adjusting the contents of alkyl and phenyl groups. The superior high-temperature resistant insulating property is 3.7 and 2.4 times higher than the national standard requirement of 1.5 kV and commercial silicone resin, respectively. The hydrogen bonds formed between SiO2, AlN, and MSR and the electrostatic adsorption between SiO2 and AlN can remarkably improve the uniform dispersion of AlN in MSR and thus enhance the insulating property, thermal conductivity, and thermal stability. With the addition of 2 wt% SiO2 and 50 wt% AlN, the SiO2-AlN/MSR composite exhibits an extremely high withstand voltage of 7.3 kV, a high thermal conductivity of 0.553 W·m-1·K-1, and an enhanced decomposition temperature of 475 °C. The superior insulating property and thermal conductivity are 4.9 and 1.3 times higher than the national standard requirement and pure MSR, respectively. This novel composite shows great potential for application in the fields requiring integrated superior insulating property, high-temperature resistance, and high thermal conductivity.
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Base de datos:
MEDLINE
Idioma:
En
Revista:
J Colloid Interface Sci
Año:
2024
Tipo del documento:
Article
País de afiliación:
China