Towards Robust Thermal MEMS: Demonstration of a Novel Approach for Solid Thermal Isolation by Substrate-Level Integrated Porous Microstructures.

Most current thermal MEMS use fragile structures such as thin-film membranes or microcantilevers for thermal isolation. To increase the robustness of these devices, solid thermal insulators that are compatible with MEMS cleanroom processing are needed. This work introduces a novel approach for microscale thermal isolation using porous microstructures created with the recently developed PowderMEMS wafer-level process. MEMS devices consisting of heaters on a thin-film membrane were modified with porous microstructures made from three different materials. A thermal model for the estimation of the resulting thermal conductivity was developed, and measurements for porous structures in ambient air and under vacuum were performed. The PowderMEMS process was successfully used to create microscale thermal insulators in silicon cavities at the wafer level. Measurements indicate thermal conductivities of close to 0.1 W/mK in ambient air and close to 0.04 W/mK for porous structures under vacuum for the best-performing material. The obtained thermal conductivities are lower than those reported for both glass and porous silicon, making PowderMEMS a very interesting alternative for solid microscale thermal isolation.

PowderMEMS-A Generic Microfabrication Technology for Integrated Three-Dimensional Functional Microstructures.

A comprehensive overview of PowderMEMS-a novel back-end-of-line-compatible microfabrication technology-is presented in this paper. The PowderMEMS process solidifies micron-sized particles via atomic layer deposition (ALD) to create three-dimensional microstructures on planar substrates from a wide variety of materials. The process offers numerous degrees of freedom for the design of functional MEMSs, such as a wide choice of different material properties and the precise definition of 3D volumes at the substrate level, with a defined degree of porosity. This work details the characteristics of PowderMEMS materials as well as the maturity of the fabrication technology, while highlighting prospects for future microdevices. Applications of PowderMEMS in the fields of magnetic, thermal, optical, fluidic, and electrochemical MEMSs are described, and future developments and challenges of the technology are discussed.

Broadband Zero-Power Wakeup MEMS Device for Energy-Efficient Sensor Nodes.

A zero-power wakeup scheme for energy-efficient sensor applications is presented in this study based on a piezoelectric MEMS energy harvester featuring wafer-level-integrated micromagnets. The proposed setup overcomes a hybrid assembly of magnets on a chip-level, a major drawback of similar existing solutions. The wakeup device can be excited at low frequencies by frequency up-conversion, both in mechanical contact and contactless methods due to magnetic force coupling, allowing various application scenarios. In a discrete circuit, a wakeup within 30−50 ms is realized in frequency up-conversion at excitation frequencies < 50 Hz. A power loss in the off state of 0.1 nW renders the scheme virtually lossless. The potential extension of battery lifetime compared to cyclical wakeup schemes is discussed for a typical wireless sensor node configuration.

Investigation of Wafer-Level Fabricated Permanent Micromagnets for MEMS.

Monolithic integration of permanent micromagnets into MEMS structures offers many advantages in magnetic MEMS applications. A novel technique called PowderMEMS, based on the agglomeration of micron-sized powders by atomic layer deposition (ALD), has been used to fabricate permanent micromagnets on 8-inch wafers. In this paper, we report the fabrication and magnetic characterization of PowderMEMS micromagnets prepared from two different NdFeB powder particle sizes. A remanence of 423 mT and intrinsic coercivity of 924 mT is achieved at the low ALD process temperature of 75 °C, making this process compatible with MEMS technology. The magnetic reversible mechanism in the micromagnets is discussed with the help of the Wohlfarth equation. To ensure the operability of such integrated micromagnets in different application environments, we conducted a set of experiments to systematically investigate the thermal and corrosive stability. NdFeB micromagnets with larger powder particle size (d50 = 25 µm) exhibit high thermal stability in air. Furthermore, the corrosion stability of the micromagnets is significantly improved by an additional silicon oxide passivation layer deposited by plasma-enhanced chemical vapor deposition (PECVD). The presented results demonstrate the durability of PowderMEMS micromagnets, enabling their application in various fields, e.g., microfluidics, sensors, actuators, and microelectronics.

Fully Integrated High-Performance MEMS Energy Harvester for Mechanical and Contactless Magnetic Excitation in Resonance and at Low Frequencies.

Energy harvesting and storage is highly demanded to enhance the lifetime of autonomous systems, such as IoT sensor nodes, avoiding costly and time-consuming battery replacement. However, cost efficient and small-scale energy harvesting systems with reasonable power output are still subjects of current development. In this work, we present a mechanically and magnetically excitable MEMS vibrational piezoelectric energy harvester featuring wafer-level integrated rare-earth micromagnets. The latter enable harvesting of energy efficiently both in resonance and from low-g, low-frequency mechanical energy sources. Under rotational magnetic excitation at frequencies below 50 Hz, RMS power output up to 74.11 µW is demonstrated in frequency up-conversion. Magnetic excitation in resonance results in open-circuit voltages > 9 V and RMS power output up to 139.39 µW. For purely mechanical excitation, the powder-based integration process allows the realization of high-density and thus compact proof masses in the cantilever design. Accordingly, the device achieves 24.75 µW power output under mechanical excitation of 0.75 g at resonance. The ability to load a capacitance of 2.8 µF at 2.5 V within 30 s is demonstrated, facilitating a custom design low-power ASIC.

Demonstration of Fully Integrable Long-Range Microposition Detection with Wafer-Level Embedded Micromagnets.

A fully integrable magnetic microposition detection for miniaturized systems like MEMS devices is demonstrated. Whereas current magnetic solutions are based on the use of hybrid mounted magnets, here a combination of Hall sensors with a novel kind of wafer-level integrable micromagnet is presented. 1D measurements achieve a precision <10 µm within a distance of 1000 µm. Three-dimensional (3D) measurements demonstrate the resolution of complex trajectories in a millimeter-sized space with precision better than 50 µm in real time. The demonstrated combination of a CMOS Hall sensor and wafer-level embedded micromagnets enables a fully integrable magnetic position detection for microdevices such as scanners, switches, valves and flow regulators, endoscopes or tactile sensors.