Interfacial Chemistry Triggers Ultrafast Radiative Recombination in Metal Halide Perovskites.

Efficient radiative recombination is essential for perovskite luminescence, but the intrinsic radiative recombination rate as a basic material property is challenging to tailor. Here we report an interfacial chemistry strategy to dramatically increase the radiative recombination rate of perovskites. By coating aluminum oxide on the lead halide perovskite, lead-oxygen bonds are formed at the perovskite-oxide interface, producing the perovskite surface states with a large exciton binding energy and a high localized density of electronic state. The oxide-bonded perovskite exhibits a ≈500 fold enhanced photoluminescence with a ≈10 fold reduced lifetime, indicating an unprecedented ≈5000 fold increase in the radiative recombination rate. The enormously enhanced radiative recombination promises to significantly promote the perovskite optoelectronic performance.

Encapsulating High-Temperature Superconducting Twisted van der Waals Heterostructures Blocks Detrimental Effects of Disorder.

High-temperature cuprate superconductors based van der Waals (vdW) heterostructures hold high technological promise. One of the obstacles hindering their progress is the detrimental effect of disorder on the properties of the vdW-devices-based Josephson junctions (JJs). Here, a new method of fabricating twisted vdW heterostructures made of Bi2 Sr2 CuCa2 O8+δ , crucially improving the JJ characteristics and pushing them up to those of the intrinsic JJs in bulk samples, is reported. The method combines cryogenic stacking using a solvent-free stencil mask technique and covering the interface by insulating hexagonal boron nitride crystals. Despite the high-vacuum condition down to 10-6 mbar in the evaporation chamber, the interface appears to be protected from water molecules during the in situ metal deposition only when fully encapsulated. Comparing the current-voltage curves of encapsulated and unencapsulated interfaces, it is revealed that the encapsulated interfaces' characteristics are crucially improved, so that the corresponding JJs demonstrate high critical currents and sharpness of the superconducting transition comparable to those of the intrinsic JJs. Finally, it is shown that the encapsulated heterostructures are more stable over time.

2D High-Temperature Superconductor Integration in Contact Printed Circuit Boards.

Inherent properties of superconducting Bi2Sr2CaCu2O8+x films, such as the high superconducting transition temperature Tc, efficient Josephson coupling between neighboring CuO layers, and fast quasiparticle relaxation dynamics, make them a promising platform for advances in quantum computing and communication technologies. However, preserving two-dimensional superconductivity during device fabrication is an outstanding experimental challenge because of the fast degradation of the superconducting properties of two-dimensional flakes when they are exposed to moisture, organic solvents, and heat. Herein, to realize superconducting devices utilizing two-dimensional (2D) superconducting films, we develop a novel fabrication technique relying on the cryogenic dry transfer of printable circuits embedded into a silicon nitride membrane. This approach separates the circuit fabrication stage requiring chemically reactive substances and ionizing physical processes from the creation of the thin superconducting structures. Apart from providing electrical contacts in a single transfer step, the membrane encapsulates the surface of the crystal, shielding it from the environment. The fabricated atomically thin Bi2Sr2CaCu2O8+x-based devices show a high superconducting transition temperature of Tc ≃ 91 K close to that of the bulk crystal and demonstrate stable superconducting properties.

Nanogap Enabled Trajectory Splitting and 3D Optical Coupling in Self-Assembled Microtubular Cavities.

We report the generation of multiple sets of 3D confined resonant modes in a single microtube cavity owing to nanogap induced resonant trajectory splits. The optical field largely overlaps in the split resonant trajectories, enabling strong optical coupling of 3D confined resonant light. The anticrossing feature and modes changing-over were demonstrated as direct evidence of strong coupling. In such an optical coupling system, the spatial optical field distribution of 3D coupling modes was experimentally mapped under the strong coupling regime, which allows direct observation of the energy transfer process between two hybrid states. Numerical calculations based on a quasi-potential model and the mode detuning process are in excellent agreement with the experimental results. The generation of multiple sets of 3D confined resonant modes and their efficient coupling in a single microcavity are of high interest for directional coupling with a higher degree of freedom to realize on-chip integration with elevated functionalities such as multiplexing, 3D lasing, and signal processing.

Wafer-Scale High-Quality Microtubular Devices Fabricated via Dry-Etching for Optical and Microelectronic Applications.

Mechanical strain formed at the interfaces of thin films has been widely applied to self-assemble 3D microarchitectures. Among them, rolled-up microtubes possess a unique 3D geometry beneficial for working as photonic, electromagnetic, energy storage, and sensing devices. However, the yield and quality of microtubular architectures are often limited by the wet-release of lithographically patterned stacks of thin-film structures. To address the drawbacks of conventionally used wet-etching methods in self-assembly techniques, here a dry-release approach is developed to roll-up both metallic and dielectric, as well as metallic/dielectric hybrid thin films for the fabrication of electronic and optical devices. A silicon thin film sacrificial layer on insulator is etched by dry fluorine chemistry, triggering self-assembly of prestrained nanomembranes in a well-controlled wafer scale fashion. More than 6000 integrated microcapacitors as well as hundreds of active microtubular optical cavities are obtained in a simultaneous self-assembly process. The fabrication of wafer-scale self-assembled microdevices results in high yield, reproducibility, uniformity, and performance, which promise broad applications in microelectronics, photonics, and opto-electronics.