Detalhe da pesquisa
1.
Nanotwin orientation on history-dependent stress decay in Cu nanopillar under constant strain.
Nanotechnology
; 33(15)2022 Jan 21.
Artigo
em Inglês
| MEDLINE | ID: mdl-34965523
2.
Effect of Elastic Strain Fluctuation on Atomic Layer Growth of Epitaxial Silicide in Si Nanowires by Point Contact Reactions.
Nano Lett
; 15(6): 4121-8, 2015 Jun 10.
Artigo
em Inglês
| MEDLINE | ID: mdl-25965773
3.
Gold catalyzed nickel disilicide formation: a new solid-liquid-solid phase growth mechanism.
Nano Lett
; 13(12): 6009-15, 2013.
Artigo
em Inglês
| MEDLINE | ID: mdl-24274698
4.
The influence of surface oxide on the growth of metal/semiconductor nanowires.
Nano Lett
; 11(7): 2753-8, 2011 Jul 13.
Artigo
em Inglês
| MEDLINE | ID: mdl-21657260
5.
Growth of multiple metal/semiconductor nanoheterostructures through point and line contact reactions.
Nano Lett
; 10(10): 3984-9, 2010 Oct 13.
Artigo
em Inglês
| MEDLINE | ID: mdl-20809607
6.
Modeling of abnormal grain growth in (111) oriented and nanotwinned copper.
Sci Rep
; 11(1): 20449, 2021 Oct 14.
Artigo
em Inglês
| MEDLINE | ID: mdl-34650223
7.
Effect of Bonding Strength on Electromigration Failure in Cu-Cu Bumps.
Materials (Basel)
; 14(21)2021 Oct 25.
Artigo
em Inglês
| MEDLINE | ID: mdl-34771919
8.
Fabrication and characteristics of highly [Formula: see text]-oriented nanotwinned Au films.
Sci Rep
; 10(1): 16566, 2020 Oct 06.
Artigo
em Inglês
| MEDLINE | ID: mdl-33024166
9.
Element Effects on High-Entropy Alloy Vacancy and Heterogeneous Lattice Distortion Subjected to Quasi-equilibrium Heating.
Sci Rep
; 9(1): 14788, 2019 Oct 15.
Artigo
em Inglês
| MEDLINE | ID: mdl-31616021
10.
Pulse electroplating of copper film: a study of process and microstructure.
J Nanosci Nanotechnol
; 8(5): 2568-74, 2008 May.
Artigo
em Inglês
| MEDLINE | ID: mdl-18572685
11.
Comparison of oxidation in uni-directionally and randomly oriented Cu films for low temperature Cu-to-Cu direct bonding.
Sci Rep
; 8(1): 10671, 2018 Jul 13.
Artigo
em Inglês
| MEDLINE | ID: mdl-30006591
12.
Suppression of interdiffusion-induced voiding in oxidation of copper nanowires with twin-modified surface.
Nat Commun
; 9(1): 340, 2018 01 23.
Artigo
em Inglês
| MEDLINE | ID: mdl-29362356
13.
Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned Cu.
Materials (Basel)
; 11(12)2018 Nov 25.
Artigo
em Inglês
| MEDLINE | ID: mdl-30477274
14.
Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient.
Sci Rep
; 8(1): 13910, 2018 Sep 17.
Artigo
em Inglês
| MEDLINE | ID: mdl-30224717
15.
Breakup of dipolar rings under a perpendicular magnetic field.
Phys Rev E Stat Nonlin Soft Matter Phys
; 64(6 Pt 1): 061503, 2001 Dec.
Artigo
em Inglês
| MEDLINE | ID: mdl-11736187
16.
Unidirectional growth of microbumps on (111)-oriented and nanotwinned copper.
Science
; 336(6084): 1007-10, 2012 May 25.
Artigo
em Inglês
| MEDLINE | ID: mdl-22628648
17.
Avoiding Loss of Catalytic Activity of Pd Nanoparticles Partially Embedded in Nanoditches in SiC Nanowires.
Nanoscale Res Lett
; 5(2): 332-7, 2009 Nov 15.
Artigo
em Inglês
| MEDLINE | ID: mdl-20672116
18.
Observation of atomic diffusion at twin-modified grain boundaries in copper.
Science
; 321(5892): 1066-9, 2008 Aug 22.
Artigo
em Inglês
| MEDLINE | ID: mdl-18719278
19.
Single crystalline PtSi nanowires, PtSi/Si/PtSi nanowire heterostructures, and nanodevices.
Nano Lett
; 8(3): 913-8, 2008 Mar.
Artigo
em Inglês
| MEDLINE | ID: mdl-18266331
20.
Periodically twinned SiC nanowires.
Nanotechnology
; 19(21): 215602, 2008 May 28.
Artigo
em Inglês
| MEDLINE | ID: mdl-21730575