Die-Attach Structure of Silicon-on-Glass MEMS Devices Considering Asymmetric Packaging Stress and Thermal Stress.

An, Jun Eon; Park, Usung; Jung, Dong Geon; Park, Chihyun; Kong, Seong Ho.

Afiliação

An JE; School of Electronics Engineering, College of IT Engineering, Kyungpook National University, Daegu 41566, Korea. imfjapan@nate.com.
Park U; The 3rd R&D Institute-4th Directorate, Agency for Defense Development, Daejeon 34186, Korea. imfjapan@nate.com.
Jung DG; The 3rd R&D Institute-4th Directorate, Agency for Defense Development, Daejeon 34186, Korea. memspark@gmail.com.
Park C; School of Electronics Engineering, College of IT Engineering, Kyungpook National University, Daegu 41566, Korea. max700128@hanmail.net.
Kong SH; Micro-infinity Co. Ltd., Suwon 16229, Korea. chpark@minfinity.com.

Sensors (Basel) ; 19(18)2019 Sep 14.

Article em En | MEDLINE | ID: mdl-31540113

Palavras-chave

asymmetric packaging stress; die attach; differential resonant accelerometer (DRA); glass-on-silicon wafer; microelectromechanical system (MEMS); silicon-on-glass process; thermal stress

Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2019 Tipo de documento: Article

Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2019 Tipo de documento: Article