Open-Air Plasma-Deposited Multilayer Thin-Film Moisture Barriers.
ACS Appl Mater Interfaces
; 12(23): 26405-26412, 2020 Jun 10.
Article
em En
| MEDLINE
| ID: mdl-32403921
ABSTRACT
Emerging moisture sensitive devices require robust encapsulation strategies to inhibit water ingress and prevent premature failure. A scalable, open-air plasma process has been developed to deposit alternating layers of conformal organosilicate and dense SiO2 thin-film barriers to prevent moisture ingress. The in situ low-temperature process is suitable for direct deposition on thermally sensitive devices and is compatible with flexible polymeric substrates. Using optical calcium testing, low water vapor transmission rates on the order of 10-3 g/m2/day at an accelerated aging condition of 38 °C and 90% relative humidity (RH) are achieved. Using moisture-sensitive perovskite devices as a representative moisture-susceptible device, devices retain over 80% of their initial performance for over 660 h in a 50 °C 50% RH accelerated aging environment. The ability of the multilayer barrier to enable device resistance to humid environments is crucial toward realizing longer operating lifetimes.
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Base de dados:
MEDLINE
Idioma:
En
Ano de publicação:
2020
Tipo de documento:
Article
País de afiliação:
Estados Unidos