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Recent progress in strain-engineered elastic platforms for stretchable thin-film devices.
Cho, Hyeon; Lee, Byeongmoon; Jang, Dongju; Yoon, Jinsu; Chung, Seungjun; Hong, Yongtaek.
Afiliação
  • Cho H; Department of Electrical and Computer Engineering, Inter-University Semiconductor Research Center (ISRC), Seoul National University, Seoul 08826, Korea. yongtaek@snu.ac.kr.
  • Lee B; Soft Hybrid Materials Research Center, Korea Institute of Science and Technology, Seoul 02792, Korea. seungjun@kist.re.kr.
  • Jang D; Department of Electrical and Computer Engineering, Inter-University Semiconductor Research Center (ISRC), Seoul National University, Seoul 08826, Korea. yongtaek@snu.ac.kr.
  • Yoon J; Department of Electrical and Computer Engineering, Inter-University Semiconductor Research Center (ISRC), Seoul National University, Seoul 08826, Korea. yongtaek@snu.ac.kr.
  • Chung S; Soft Hybrid Materials Research Center, Korea Institute of Science and Technology, Seoul 02792, Korea. seungjun@kist.re.kr.
  • Hong Y; KHU-KIST Department of Converging Science and Technology, Kyung Hee University, Seoul, 02447, Korea.
Mater Horiz ; 9(8): 2053-2075, 2022 08 01.
Article em En | MEDLINE | ID: mdl-35703019
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Texto completo: 1 Base de dados: MEDLINE Assunto principal: Dispositivos Eletrônicos Vestíveis Idioma: En Ano de publicação: 2022 Tipo de documento: Article
Texto completo
Imprimir
XML
PubMed Links
Buscar no Google

Texto completo: 1 Base de dados: MEDLINE Assunto principal: Dispositivos Eletrônicos Vestíveis Idioma: En Ano de publicação: 2022 Tipo de documento: Article