Atomic Fe/Zn anchored N, S co-doped nano-porous carbon for boosting oxygen reduction reaction.

Liu, Dawei; Srinivas, Katam; Chen, Anran; Ma, Fei; Yu, Hesheng; Zhang, Ziheng; Wang, Mengya; Wu, Yu; Chen, Yuanfu

Liu, Dawei; Srinivas, Katam; Chen, Anran; Ma, Fei; Yu, Hesheng; Zhang, Ziheng; Wang, Mengya; Wu, Yu; Chen, Yuanfu.

Afiliação

Liu D; School of Integrated Circuit Science and Engineering, and State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, PR China.
Srinivas K; School of Integrated Circuit Science and Engineering, and State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, PR China.
Chen A; School of Materials and Energy, Yunnan University, Kunming 650091, PR China.
Ma F; School of Integrated Circuit Science and Engineering, and State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, PR China.
Yu H; School of Integrated Circuit Science and Engineering, and State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, PR China.
Zhang Z; School of Integrated Circuit Science and Engineering, and State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, PR China.
Wang M; School of Integrated Circuit Science and Engineering, and State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, PR China.
Wu Y; School of Integrated Circuit Science and Engineering, and State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, PR China.
Chen Y; School of Integrated Circuit Science and Engineering, and State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, PR China. Electronic address: yfchen@uestc.edu.cn.