[Study on the compositions in the interface of corrosion inhibition membrane/copper plating layer/iron substrate by depth etching and photoelectron spectroscopy].
Guang Pu Xue Yu Guang Pu Fen Xi
; 26(1): 166-9, 2006 Jan.
Article
in Zh
| MEDLINE
| ID: mdl-16827371
ABSTRACT
In order to explore the reason for the weak bond intensity between pyro-phosphate copper plating layer and iron substrate, spectrum technology was adopted. The compositions of various elements in the perpendicular interface were analyzed. The effect of surface roughness in the metal substrate on various elements distribution was discussed. According to etching time, the membrane layer was divided into three portions surface layer with nitrogen and oxygen content decreasing quickly, mesosphere of basic fixed composition, and mix disturbing layer with substrate element appearing and occupying a half thickness. Through analyzing oxygen content in the mix layer, it was concluded that the oxygen layer in the interface of copper layer/iron substrate was the main cause of influencing the bond intensity between the plating layer and substrate.
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Collection:
01-internacional
Database:
MEDLINE
Language:
Zh
Journal:
Guang Pu Xue Yu Guang Pu Fen Xi
Year:
2006
Type:
Article
Affiliation country:
China