Ag metal interconnect wires formed by pseudoplastic nanoparticles fluid imprinting lithography with microwave assistant sintering.

Liu, Boyu; Yu, Yongli; Hu, Zhennan; Li, Mengke; Ma, Liuhong; Sun, Haibin; Jia, Jianxin; Jiang, Changhui; Zhong, Yinghui; Chen, Yuwei; Duan, Zhiyong.

Affiliation

Liu B; School of Physical and Microelectronics, Zhengzhou 450001, People's Republic of China.
Yu Y; Institute of Intelligent Sensing, Zhengzhou 450001, People's Republic of China.
Hu Z; School of Physical and Microelectronics, Zhengzhou 450001, People's Republic of China.
Li M; Institute of Intelligent Sensing, Zhengzhou 450001, People's Republic of China.
Ma L; School of Physical and Microelectronics, Zhengzhou 450001, People's Republic of China.
Sun H; Institute of Intelligent Sensing, Zhengzhou 450001, People's Republic of China.
Jia J; School of Physical and Microelectronics, Zhengzhou 450001, People's Republic of China.
Jiang C; Institute of Intelligent Sensing, Zhengzhou 450001, People's Republic of China.
Zhong Y; School of Physical and Microelectronics, Zhengzhou 450001, People's Republic of China.
Chen Y; Institute of Intelligent Sensing, Zhengzhou 450001, People's Republic of China.
Duan Z; Remote Sensing and Photogrammetry, Finnish Geospatial Research Institute, Helsinki FL-02430, Finland.