Effects of Residual Stress Distribution on Interfacial Adhesion of Magnetron Sputtered AlN and AlN/Al Nanostructured Coatings on a (100) Silicon Substrate.

Ali, Rashid; Renzelli, Marco; Khan, M Imran; Sebastiani, Marco; Bemporad, Edoardo

Ali, Rashid; Renzelli, Marco; Khan, M Imran; Sebastiani, Marco; Bemporad, Edoardo.

Afiliação

Ali R; Faculty of Materials and Chemical Engineering, Ghulam Ishaq Khan Institute of Engineering Sciences and Technology, Topi, Swabi 23640, KPK, Pakistan. rashidali@giki.edu.pk.
Renzelli M; LFoundry s.r.l., via Pacinotti, 7 Avezzano, 67051 L'Aquila, Italy. renzelli.marco@gmail.com.
Khan MI; Faculty of Materials and Chemical Engineering, Ghulam Ishaq Khan Institute of Engineering Sciences and Technology, Topi, Swabi 23640, KPK, Pakistan. imrankhan@giki.edu.pk.
Sebastiani M; Engineering Department, Università degli studi Roma Tre, via dellaVasca Navale, 79, 00146 Rome, Italy. seba@uniroma3.it.
Bemporad E; Engineering Department, Università degli studi Roma Tre, via dellaVasca Navale, 79, 00146 Rome, Italy. edoardo.bemporad@uniroma3.it.

Nanomaterials (Basel) ; 8(11)2018 Nov 01.

Article em En | MEDLINE | ID: mdl-30388839

Palavras-chave

AlN/Al coating; indentation failure modes; magnetron sputtering; nanoindentation adhesion; nanoscale residual stress profiling; physical vapor deposition; residual stresses; silicon substrate; wafer curvature method

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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Nanomaterials (Basel) Ano de publicação: 2018 Tipo de documento: Article País de afiliação: Paquistão

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