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Skin-integrated wireless haptic interfaces for virtual and augmented reality.
Yu, Xinge; Xie, Zhaoqian; Yu, Yang; Lee, Jungyup; Vazquez-Guardado, Abraham; Luan, Haiwen; Ruban, Jasper; Ning, Xin; Akhtar, Aadeel; Li, Dengfeng; Ji, Bowen; Liu, Yiming; Sun, Rujie; Cao, Jingyue; Huo, Qingze; Zhong, Yishan; Lee, ChanMi; Kim, SeungYeop; Gutruf, Philipp; Zhang, Changxing; Xue, Yeguang; Guo, Qinglei; Chempakasseril, Aditya; Tian, Peilin; Lu, Wei; Jeong, JiYoon; Yu, YongJoon; Cornman, Jesse; Tan, CheeSim; Kim, BongHoon; Lee, KunHyuk; Feng, Xue; Huang, Yonggang; Rogers, John A.
Afiliação
  • Yu X; Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China.
  • Xie Z; Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China.
  • Yu Y; Department of Engineering Mechanics, Dalian University of Technology, Dalian, China.
  • Lee J; Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, USA.
  • Vazquez-Guardado A; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.
  • Luan H; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.
  • Ruban J; Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Ning X; Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Akhtar A; School of Materials Science and Engineering, Tsinghua University, Beijing, China.
  • Li D; NeuroLux Corporation, Evanston, IL, USA.
  • Ji B; Simpson Querrey Institute, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.
  • Liu Y; Simpson Querrey Institute, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.
  • Sun R; NeuroLux Corporation, Evanston, IL, USA.
  • Cao J; Department of Aerospace Engineering, Pennsylvania State University, University Park, PA, USA.
  • Huo Q; PSYONIC, Inc., Champaign, IL, USA.
  • Zhong Y; Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China.
  • Lee C; Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, USA.
  • Kim S; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.
  • Gutruf P; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.
  • Zhang C; Department of Micro/Nano Electronics, Shanghai Jiao Tong University, Shanghai, China.
  • Xue Y; Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China.
  • Guo Q; Bristol Composites Institute, University of Bristol, Bristol, UK.
  • Chempakasseril A; Wearifi, Inc., Evanston, IL, USA.
  • Tian P; Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, USA.
  • Lu W; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.
  • Jeong J; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.
  • Yu Y; Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Cornman J; Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Tan C; Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Kim B; Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Lee K; Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Feng X; Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Huang Y; Department of Biomedical Engineering, University of Arizona, Tucson, AZ, USA.
  • Rogers JA; AML, Department of Engineering Mechanics, Interdisciplinary Research Center for Flexible Electronics Technology, Tsinghua University, Beijing, China.
Nature ; 575(7783): 473-479, 2019 11.
Article em En | MEDLINE | ID: mdl-31748722
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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Assunto principal: Pele / Tato / Interface Usuário-Computador / Desenho de Equipamento / Tecnologia sem Fio / Realidade Virtual / Realidade Aumentada Tipo de estudo: Qualitative_research Limite: Female / Humans / Male Idioma: En Revista: Nature Ano de publicação: 2019 Tipo de documento: Article País de afiliação: China
Texto completo
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XML
PubMed Links
Buscar no Google

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Assunto principal: Pele / Tato / Interface Usuário-Computador / Desenho de Equipamento / Tecnologia sem Fio / Realidade Virtual / Realidade Aumentada Tipo de estudo: Qualitative_research Limite: Female / Humans / Male Idioma: En Revista: Nature Ano de publicação: 2019 Tipo de documento: Article País de afiliação: China