Spalling-Induced Liftoff and Transfer of Electronic Films Using a van der Waals Release Layer.

Blanton, Eric W; Motala, Michael J; Prusnick, Timothy A; Hilton, Albert; Brown, Jeff L; Bhattacharyya, Arkka; Krishnamoorthy, Sriram; Leedy, Kevin; Glavin, Nicholas R; Snure, Michael

Blanton, Eric W; Motala, Michael J; Prusnick, Timothy A; Hilton, Albert; Brown, Jeff L; Bhattacharyya, Arkka; Krishnamoorthy, Sriram; Leedy, Kevin; Glavin, Nicholas R; Snure, Michael.

Afiliação

Blanton EW; KBR, Beavercreek, OH, 45431, USA.
Motala MJ; UES, Dayton, OH, 45432, USA.
Prusnick TA; KBR, Beavercreek, OH, 45431, USA.
Hilton A; KBR, Beavercreek, OH, 45431, USA.
Brown JL; KBR, Beavercreek, OH, 45431, USA.
Bhattacharyya A; Electrical and Computer Engineering, University of Utah, Salt Lake City, UT, 84112, USA.
Krishnamoorthy S; Electrical and Computer Engineering, University of Utah, Salt Lake City, UT, 84112, USA.
Leedy K; Materials Department, University of California, Santa Barbara, Santa Barbara, CA, 93106, USA.
Glavin NR; Air Force Research Laboratory, Sensors Directorate, WPAFB, OH, 45433, USA.
Snure M; Air Force Research Laboratory, Materials and Manufacturing Directorate, WPAFB, 45433, USA.

Small ; 17(42): e2102668, 2021 10.

Article em En | MEDLINE | ID: mdl-34541817

Assuntos

Eletricidade; Eletrônica

Palavras-chave

HEMTs; heterogeneous integration; van der Waals release layers

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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Assunto principal: Eletricidade / Eletrônica Idioma: En Revista: Small Assunto da revista: ENGENHARIA BIOMEDICA Ano de publicação: 2021 Tipo de documento: Article País de afiliação: Estados Unidos

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