Ultrahigh Thermal Conductivity of Epoxy/Ag Flakes/MXene@Ag Composites Achieved by In Situ Sintering of Silver Nanoparticles.

The growing use of high-power and integrated electronic devices has created a need for thermal conductive adhesives (TCAs) with high thermal conductivity (TC) to manage heat dissipation at the interface. However, TCAs are often limited by contact thermal resistance at the interface between materials. In this study, we synthesized MXene@Ag composites through a direct in situ reduction process. The Ag nanoparticles (Ag NPs) generated by the reduction of the MXene interlayer and surface formed effective thermally conductive pathways with Ag flakes within an epoxy resin matrix. Various characterization analyses revealed that adding MXene@Ag composites at a concentration of 3 wt % resulted in a remarkable TC of 40.80 W/(m·K). This value is 8.77 times higher than that achieved with Ag flakes and 7.9 times higher than with MXene filler alone. The improved TC is attributed to the sintering of the in situ reduced Ag NPs during the curing process, which formed a connection between MXene (a highly conductive material) and the Ag flakes, thereby reducing contact thermal resistance. This reduction in contact thermal resistance significantly enhanced the TC of the thermal interface materials (TIMs). This study presents a novel approach for developing materials with exceptionally high TC, opening new possibilities for the design and fabrication of advanced thermal management systems.

Emerging Non-Noble-Metal Atomic Layer Deposited Copper as Seeds for Electroless Copper Deposition.

Copper metal catalyst seeds have recently triggered much research interest for the development of low-cost and high-performance metallic catalysts with industrial applications. Herein, we present metallic Cu catalyst seeds deposited by an atomic layer deposition method on polymer substrates. The atomic layer deposited Cu (ALD-Cu) can ideally substitute noble metals Ag, Au, and Pd to catalyze Cu electroless deposition. The optimized deposition temperature and growth cycles of an ALD-Cu catalyzed seed layer have been obtained to achieve a flexible printed circuit (FPC) with a high performance electroless plating deposited Cu (ELD-Cu) film. The ELD-Cu films on the ALD-Cu catalyst seeds grown display a uniform and dense deposition with a low resistivity of 1.74 µΩ·cm, even in the through via and trench of substates. Furthermore, the ALD-Cu-catalyzed ELD-Cu circuits and LED devices fabricated on treated PI also demonstrate excellent conductive and mechanical features. The remarkable conductive and mechanical characteristics of the ALD-Cu seed catalyzed ELD-Cu process demonstrate its tremendous potential in high-density integrated FPC applications.

Effect of lead-free glass on the current transmission method at the Ag/Si interface in crystalline silicon solar cells.

Environmental protection mandates have spurred the widespread adoption of lead-free glass in electronic material adhesion. Glass powder, crucial for solar silver paste, notably affects the ohmic contact at the Ag-Si interface of crystalline silicon solar cells. This study examines how TeO2 content influences the high-temperature flowability and wettability of lead-free Bi2O3-TeO2-based glass powder, alongside the interplay between the glass's thermal properties and interface contact. Additionally, it investigates the Bi2O3-TeO2 ratio's impact on current transmission through the interfacial glass layer. Experimental results show that the synthesized glass powder exhibits superior high-temperature flowability and wettability, with a low contact resistance of 1.5 mΩ cm2 in silver paste applications. This study also proposes an optimal approach for enhancing current transmission through the interfacial glass layer. Consequently, this glass powder is highly valuable for c-Si solar cell silver paste applications, offering novel insights into improving current transmission efficiency.

Effect of Silver Powder Microstructure on the Performance of Silver Powder and Front-Side Solar Silver Paste.

Silver powder, as the primary component of solar silver paste, significantly influences various aspects of the paste's performance, including printing, sintering, and conductivity. This study reveals that, beyond the shape and size of the silver powders, their microstructure is a critical factor influencing the performance of both silver powders and silver pastes in solar cell applications. The growth process leads to the formation of either polycrystalline aggregated silver powder or crystal growth silver powder. Analyzing the performance characteristics of these different microstructures provides guidance for selecting silver powders for silver pastes at different sintering temperatures. Polycrystalline aggregated silver powder exhibits higher sintering activity, with a sintering initiation temperature around 450 °C. The resulting silver paste, sintered at 750 °C, demonstrates a low sheet resistance of 2.92 mΩ/sq and high adhesion of 2.13 N. This silver powder is suitable for formulating silver pastes with lower sintering temperatures. The solar cell electrode grid lines have a high aspect ratio of 0.37, showing poor uniformity. However, due to the high sintering activity of the silver powder, the glass layer dissolves and deposits more silver, resulting in excellent conductivity, a low contact resistance of the silver electrode, a low series resistance of the solar cell of 1.23 mΩ, and a high photoelectric conversion efficiency of 23.16%. Crystal growth silver powder exhibits the highest tap density of 5.52 g/cm3. The corresponding silver paste shows improved densification upon sintering, especially at 840 °C, yielding a sheet resistance of 2.56 mΩ/sq and adhesion of 3.05 N. This silver powder is suitable for formulating silver pastes with higher sintering temperatures. The solar cell electrode grid lines are uniform with the highest aspect ratio of 0.40, resulting in a smaller shading area, a high fill factor of 81.59%, and a slightly higher photoelectric conversion efficiency of 23.17% compared to the polycrystalline aggregated silver powder.

Study on Low-Temperature Conductive Silver Pastes Containing Bi-Based Glass for MgTiO3 Electronic Power Devices.

Low-temperature lead-free silver pastes deserve thorough investigation for sustainable development and application of MgTiO3 ceramics in electronic devices. In this study, a series of Bi2O3-B2O3-ZnO-SiO2-Al2O3-CaO glasses with suitable softening temperatures were prepared via melt quenching using a type of micrometer silver powder formed by silver nanoparticle aggregates. The composite pastes containing silver powder, Bi2O3 glass powder and an organic vehicle were then screen-printed. The effects of glass powder concentration and sintering temperature on the microstructure of the surface interface were also investigated. The results showed that the silver paste for microwave dielectric ceramic filters (MgTiO3) possessed good electrical conductivity (2.28 mΩ/□) and high adhesion (43.46 N/mm2) after medium temperature (670 °C) sintering. Thus, this glass powder has great application potential in non-toxic lead-free silver pastes for metallization of MgTiO3 substrates.

Different Bonding Defects on Dual-Metal Single-Atom Electrocatalyst CoZnN6 (OH) for Oxygen Reduction Reaction.

Since dual-metal single-atom catalyst (CoZnN/C) has been experimentally synthesized by atomically arching CoZn on N-doped carbon nanofibers and exhibited potential electrocatalysis activity towards oxygen reduction reaction (ORR), we perform first-principles calculations to identify the highly active sites at different defects by comparing the four-step ORR processes on the constructed four CoZnN6 models on graphene. The corresponding N-edge effect, dopant effect, and C-edge ring-closing effect are evaluated with the ORR evolution on different bonding environments, including pristine CoZnN6 (OH), nanoribbon (NR) along zigzag direction, substitution of carbon/oxygen (C/O substitution), and C-edge ring-closing configurations. OH-ligand is shown to significantly improve the ORR activities for all the considered structures. Especially, C-substituted CoZnN6 (OH), NR-CoZnN5 O(OH) and CoZnN6 (OH) with C-edge-effect exhibit obviously reduced overpotentials (ηlim =0.28, 0.48 and 0.41 V) of rate-determining steps among all the considered nine candidates. By plotting the relationship between the limiting potentials (Ulim ) and free energies of intermediate *OH (ΔGOH* ), two prior catalysts of pristine-CoZnN5 C(OH) and defect-CoZnN6 CH(OH) are located near the top of the volcano curve with higher Ulim =0.95 and 0.82 V than Pt(111) (Ulim =0.80 V), implying that C-substitution could facilitate ORR performance in pristine- and defect-CoZnN6 (OH) bonding situation.

Ag-NPs/MWCNT composite-modified silver-epoxy paste with improved thermal conductivity.

Heat dissipation is a critical issue in high-performance electronics, which needs to be solved, and an electronic paste is a good choice to solve this issue. In this paper, silver nanoparticles/multi-walled carbon nanotube (Ag-NPs/MWCNT) composites were prepared by the chemical process for the modification of electronic pastes. The micromorphology and spectral analysis of the as-prepared Ag-NPs/MWCNT composites indicated that Ag-NPs were uniformly distributed on the MWCNT surfaces with high distribution densities; the average size of Ag-NPs was estimated to be 8.29 nm. The as-obtained Ag-NPs/MWCNT composites were then added to a silver-epoxy paste. Field emission scanning electron microscopy (FESEM), thermogravimetry (TG) and thermal conductivity analyses suggested the incorporation of Ag-NPs/MWCNT composites in the silver-epoxy paste; Ag flakes were better connected by Ag-NPs/MWCNTs, which improved the thermal conductivity of the paste from 0.73 to 0.96 W m-1 K-1. However, more weight loss was observed when Ag-NPs/MWCNTs were incorporated in the silver-epoxy paste. Overall, the addition of Ag-NPs/MWCNTs into the silver-epoxy paste increased the thermal conductivity, which can be applied to high-performance electronics.