RESUMEN
With the innovation of microelectronics technology, the heat dissipation problem inside the device will face a severe test. In this work, cellulose aerogel (CA) with highly enhanced thermal conductivity (TC) in vertical planes was successfully obtained by constructing a vertically aligned silicon carbide nanowires (SiC NWs)/boron nitride (BN) network via the ice template-assisted strategy. The unique network structure of SiC NWs connected to BN ensures that the TC of the composite in the vertical direction reaches 2.21 W m-1 K-1 at a low hybrid filler loading of 16.69 wt%, which was increased by 890% compared to pure epoxy (EP). In addition, relying on unique porous network structure of CA, EP-based composite also showed higher TC than other comparative samples in the horizontal direction. Meanwhile, the composite exhibits good electrically insulating with a volume electrical resistivity about 2.35 × 1011 Ω cm and displays excellent electromagnetic wave absorption performance with a minimum reflection loss of - 21.5 dB and a wide effective absorption bandwidth (< - 10 dB) from 8.8 to 11.6 GHz. Therefore, this work provides a new strategy for manufacturing polymer-based composites with excellent multifunctional performances in microelectronic packaging applications.