RESUMEN
As the development of manufacturing technology for electronic devices, propresses it is necessary to study manufacturing technologies for mass storage, low-volume, improved reliability, and low cost materials for electronic devices used in data communication. The noble metals are the most commonly used raw materials used in such manufacturing. However, the raw materials (Ag, Pt, etc.) are expensive and raise the manufacturing cost. So, there is a need to replace these materials with raw materials of low cost. Recently, the much-cheaper Cu has received attention in that it has the same properties as the noble metals. Cu has good physical and chemical properties. However, its anti-oxidation is weak. Therefore, to make up for this weak point, research has generally been conducted to find a method to coat copper with a noble metal. The coating, comprised of the noble metal, is strong against the oxidation of the Cu surface. In this study, we made Cu@Ag core-shell nanoparticles; these particles have the same level of electro-conductivity as Ag. These materials are expected to reduce the product cost of raw materials.