RESUMEN
This research addresses the fatigue behavior of freestanding nickel-molybdenum-tungsten (Ni-Mo-W) thin films with high-density planar faults. The as-deposited Ni-Mo-W thin films demonstrate an unprecedented fatigue life, withstanding over a million cycles at a Goodman stress amplitude (Sa,Goodman) of 2190 MPa - nearly 80% of the tensile strength. The texture, columnar grain width, planar fault configuration (spacing and orientation), and tensile strength were unchanged after annealing at 500 °C for 24 hours, and the film endured over 2 × 105 cycles at Sa,Goodman of 1050 MPa. The fatigue life of annealed Ni-Mo-W thin films is comparable to those of nanocrystalline Ni-based alloys, but has deteriorated significantly compared to that of the as-deposited films. The high fatigue strength of Ni-Mo-W thin films is ascribed to extremely dense planar faults suppressing fatigue crack initiation, and planar fault-dislocation interaction and grain boundary plasticity are proposed as mechanisms responsible for the fatigue failure. Provisionally the latter is a more convincing account of the experimental results, in which changes in the grain boundary characteristics after annealing cause higher susceptibility to stress concentration during cyclic loading. The fatigue behavior revealed in this work consolidates the thermal and mechanical reliability of Ni-Mo-W thin films for potential nano-structural applications.
RESUMEN
Silicon-based microelectromechanical systems (MEMS) sensors have become ubiquitous in consumer-based products, but realization of an interconnected network of MEMS devices that allows components to be remotely monitored and controlled, a concept often described as the "Internet of Things," will require a suite of MEMS materials and properties that are not currently available. We report on the synthesis of metallic nickel-molybdenum-tungsten films with direct current sputter deposition, which results in fully dense crystallographically textured films that are filled with nanotwins. These films exhibit linear elastic mechanical behavior and tensile strengths exceeding 3 GPa, which is unprecedented for materials that are compatible with wafer-level device fabrication processes. The ultrahigh strength is attributed to a combination of solid solution strengthening and the presence of dense nanotwins. These films also have excellent thermal and mechanical stability, high density, and electrical properties that are attractive for next-generation metal MEMS applications.
RESUMEN
The theoretical strength of a material is the minimum stress to deform or fracture the perfect single crystal material that has no defects. This theoretical strength is considered as an upper bound on the attainable strength for a real crystal. In contradiction to this expectation, we use quantum mechanics (QM) simulations to show that for the boron carbide (B4C) hard ceramic, this theoretical shear strength can be exceeded by 11% by imposing nanoscale twins. We also predict from QM that the indentation strength of nanotwinned B4C is 12% higher than that of the perfect crystal. Further, we validate this effect experimentally, showing that nanotwinned samples are harder by 2.3% than the twin-free counterpart of B4C. The origin of this strengthening mechanism is suppression of twin boundary (TB) slip within the nanotwins due to the directional nature of covalent bonds at the TB.
RESUMEN
Reactive nanolaminates afford a promising route for the low-temperature synthesis of zirconium diboride, an ultrahigh-temperature ceramic with metallic properties. Although the addition of carbon is known to facilitate sintering of ZrB2, its effect on the kinetics of the formation reaction has not been elucidated. We have employed a combined approach of nanocalorimetry and first-principles theoretical studies to investigate the kinetic role of carbon in the synthesis of ZrB2 using B4C/Zr reactive nanolaminates. Structural characterization of the laminates by XRD and TEM reveal that the reaction proceeds via interdiffusion of the B4C and Zr layers, which produces an amorphous Zr3B4C alloy. This amorphous alloy then crystallizes to form a supersaturated ZrB2(C) compound. A kinetic analysis shows that carbon lowers the energy barriers for both interdiffusion and crystallization by more than 20%. Energetic calculations based on first-principles modeling suggest that the reduction of the diffusion barrier may be attributed to the stronger bonding between Zr and C as compared to the bonding between Zr and B.
RESUMEN
Metal nanoparticle solutions are widely used for the fabrication of printed electronic devices. The mechanical properties of the solution-processed metal nanoparticle thin films are very important for the robust and reliable operation of printed electronic devices. In this paper, we report the tensile characteristics of silver nanoparticle (Ag NP) thin films on flexible polymer substrates by observing the microstructures and measuring the electrical resistance under tensile strain. The effects of the annealing temperatures and periods of Ag NP thin films on their failure strains are explained with a microstructural investigation. The maximum failure strain for Ag NP thin film was 6.6% after initial sintering at 150 °C for 30 min. Thermal annealing at higher temperatures for longer periods resulted in a reduction of the maximum failure strain, presumably due to higher porosity and larger pore size. We also found that solution-processed Ag NP thin films have lower failure strains than those of electron beam evaporated Ag thin films due to their highly porous film morphologies.
