RESUMEN
Herein, we improved the performance of Si/graphite (Si/C) composite anodes by introducing a highly adhesive co-polyimide (P84) binder and investigated the relationship between their electrochemical and adhesion properties using the 90° peel test and a surface and interfacial cutting analysis system. Compared to those of conventional poly(vinylidene fluoride) (PVdF)-based electrodes, the cycling performance and rate capability of P84-based Si/C anodes were improved by 47.0% (372 vs 547 mAh g-1 after 100 cycles at a 60 mA g-1 discharge condition) and 33.4% (359 vs 479 mAh g-1 after 70 cycles at a 3.0 A g-1 discharge condition), respectively. Importantly, the P84-based electrodes exhibited less pronounced morphological changes and a smaller total cell resistance after cycling than the PVdF-based ones, also showing better interlayer adhesion (F mid) and interfacial adhesion to Cu current collectors (F inter).
RESUMEN
A new Cu current collector was prepared by introducing a mussel-inspired polydopamine coating onto a Cu foil surface to improve the electrochemical performance of a Si electrode. The polydopamine coating covalently bonded the polymeric binder (with hydroxyl functional groups) via a condensation reaction. The coating improved the adhesion strength between the Si composite electrode and the Cu current collector (245.5 N m(-1), 297.5 N m(-1), and 353.2 N m(-1) for the Si electrodes based on bare Cu, polydopamine-treated Cu without thermal treatment, and polydopamine-treated Cu with thermal treatment, respectively). We demonstrate that the detachment between the Si composite electrode and the current collector plays an important role in determining the electrochemical performance of the Si electrode. The cycle life and rate capability of the Si electrode improved when the polydopamine surface-treated Cu current collector was used (963.9 mAh g(-1), 1361.1 mAh g(-1), and 1590.0 mAh g(-1) for the Si electrodes based on bare Cu, polydopamine-treated Cu without thermal treatment, and polydopamine-treated Cu with thermal treatment, respectively, at C/2 after 500 cycles).