Design Guidelines for Thin Diaphragm-Based Microsystems through Comprehensive Numerical and Analytical Studies.

This paper presents comprehensive guidelines for the design and analysis of a thin diaphragm that is used in a variety of microsystems, including microphones and pressure sensors. It highlights the empirical relations that can be utilized for the design of thin diaphragm-based microsystems (TDMS). Design guidelines developed through a Finite Element Analysis (FEA) limit the iterative efforts to fabricate TDMS. These design guidelines are validated analytically, with the assumption that the material properties are isotropic, and the deviation from anisotropic material is calculated. In the FEA simulations, a large deflection theory is taken into account to incorporate nonlinearity, such that a critical dimensional ratio of a/h or 2r/h can be decided to have the linear response of a thin diaphragm. The observed differences of 12% in the deflection and 13% in the induced stresses from the analytical calculations are attributed to the anisotropic material consideration in the FEA model. It suggests that, up to a critical ratio (a/h or 2r/h), the thin diaphragm shows a linear relationship with a high sensitivity. The study also presents a few empirical relations to finalize the geometrical parameters of the thin diaphragm in terms of its edge length or radius and thickness. Utilizing the critical ratio calculated in the static FEA analysis, the basic conventional geometries are considered for harmonic analyses to understand the frequency response of the thin diaphragms, which is a primary sensing element for microphone applications and many more. This work provides a solution to microelectromechanical system (MEMS) developers for reducing cost and time while conceptualizing TDMS designs.

Investigation of temperature sensitivity of a MEMS gravimeter based on geometric anti-spring.

This paper describes a technique for temperature sensitivity or thermal sag measurements of a geometric anti-spring based microelectromechanical system (MEMS) gravimeter (Wee-g). The Wee-g MEMS gravimeter is currently fabricated on a (100) silicon wafer using standard micro-nano fabrication techniques. The thermal behavior of silicon indicates that the Young's modulus of silicon decreases with increase in temperature (∼64 ppm/K). This leads to a softening of the silicon material, resulting in the proof mass displacing (or sagging) under the influence of increasing temperature. It results in a change in the measured gravity, which is expressed as temperature sensitivity in terms of change in gravity per degree temperature. The temperature sensitivity for the silicon based MEMS gravimeter is found to be 60.14-64.87, 61.76, and 62.76 µGal/mK for experimental, finite element analysis (FEA) simulation, and analytical calculations, respectively. It suggests that the gravimeter's temperature sensitivity is dependent on the material properties used to fabricate the MEMS devices. In this paper, the experimental measurements of thermal sag are presented along with analytical calculations and simulations of the effect using FEA. The bespoke optical measurement system to quantify the thermal sag is also described. The results presented are an essential step toward the development of temperature insensitive MEMS gravimeters.