Combined Femtosecond Laser Glass Microprocessing for Liver-on-Chip Device Fabrication.

Nowadays, lab-on-chip (LOC) devices are attracting more and more attention since they show vast prospects for various biomedical applications. Usually, an LOC is a small device that serves a single laboratory function. LOCs show massive potential for organ-on-chip (OOC) device manufacturing since they could allow for research on the avoidance of various diseases or the avoidance of drug testing on animals or humans. However, this technology is still under development. The dominant technique for the fabrication of such devices is molding, which is very attractive and efficient for mass production, but has many drawbacks for prototyping. This article suggests a femtosecond laser microprocessing technique for the prototyping of an OOC-type device-a liver-on-chip. We demonstrate the production of liver-on-chip devices out of glass by using femtosecond laser-based selective laser etching (SLE) and laser welding techniques. The fabricated device was tested with HepG2(GS) liver cancer cells. During the test, HepG2(GS) cells proliferated in the chip, thus showing the potential of the suggested technique for further OOC development.

Femtosecond Laser Assisted 3D Etching Using Inorganic-Organic Etchant.

Selective laser etching (SLE) is a technique that allows the fabrication of arbitrarily shaped glass micro-objects. In this work, we show how the capabilities of this technology can be improved in terms of selectivity and etch rate by applying an etchant solution based on a Potassium Hydroxide, water, and isopropanol mixture. By varying the concentrations of these constituents, the wetting properties, as well as the chemical reaction of fused silica etching, can be changed, allowing us to achieve etching rates in modified fused silica up to 820 µm/h and selectivity up to ∼3000. This is used to produce a high aspect ratio (up to 1:1000), straight and spiral microfluidic channels which are embedded inside a volume of glass. Complex 3D glass micro-structures are also demonstrated.

Sapphire Selective Laser Etching Dependence on Radiation Wavelength and Etchant.

Transparent and high-hardness materials have become the object of wide interest due to their optical and mechanical properties; most notably, concerning technical glasses and crystals. A notable example is sapphire-one of the most rigid materials having impressive mechanical stability, high melting point and a wide transparency window reaching into the UV range, together with impressive laser-induced damage thresholds. Nonetheless, using this material for 3D micro-fabrication is not straightforward due to its brittle nature. On the microscale, selective laser etching (SLE) technology is an appropriate approach for such media. Therefore, we present our research on C-cut crystalline sapphire microprocessing by using femtosecond radiation-induced SLE. Here, we demonstrate a comparison between different wavelength radiation (1030 nm, 515 nm, 343 nm) usage for material modification and various etchants (hydrofluoric acid, sodium hydroxide, potassium hydroxide and sulphuric and phosphoric acid mixture) comparison. Due to the inability to etch crystalline sapphire, regular SLE etchants, such as hydrofluoric acid or potassium hydroxide, have limited adoption in sapphire selective laser etching. Meanwhile, a 78% sulphuric and 22% phosphoric acid mixture at 270 °C temperature is a good alternative for this process. We present the changes in the material after the separate processing steps. After comparing different processing protocols, the perspective is demonstrated for sapphire structure formation.

Optimization of selective laser etching (SLE) for glass micromechanical structure fabrication.

In this work, we show how femtosecond (fs) laser-based selective glass etching (SLE) can be used to expand capabilities in fabricating 3D structures out of a single piece of glass. First, an investigation of the etching process is performed, taking into account various laser parameters and scanning strategies. These results provide critical insights into the optimization of the process allowing to increase manufacturing throughput. Afterward, various complex 3D glass structures such as microfluidic elements embedded inside the volume of glass or channel systems with integrated functional elements are produced. A single helix spring of 1 mm diameter is also made, showing the possibility to compress it by 50%. Finally, 3D structuring capabilities are used to produce an assembly-free movable ball-joint-based chain and magnet-actuated Geneva mechanism. Due to minimized friction caused by low (down to 200 nm RMS) surface roughness of SLE-produced structures, the Geneva mechanism was shown to be capable of rotating up to 2000 RPM.

3D Manufacturing of Glass Microstructures Using Femtosecond Laser.

The rapid expansion of femtosecond (fs) laser technology brought previously unavailable capabilities to laser material processing. One of the areas which benefited the most due to these advances was the 3D processing of transparent dielectrics, namely glasses and crystals. This review is dedicated to overviewing the significant advances in the field. First, the underlying physical mechanism of material interaction with ultrashort pulses is discussed, highlighting how it can be exploited for volumetric, high-precision 3D processing. Next, three distinct transparent material modification types are introduced, fundamental differences between them are explained, possible applications are highlighted. It is shown that, due to the flexibility of fs pulse fabrication, an array of structures can be produced, starting with nanophotonic elements like integrated waveguides and photonic crystals, ending with a cm-scale microfluidic system with micro-precision integrated elements. Possible limitations to each processing regime as well as how these could be overcome are discussed. Further directions for the field development are highlighted, taking into account how it could synergize with other fs-laser-based manufacturing techniques.

Optical damage thresholds of microstructures made by laser three-dimensional nanolithography: publisher's note.

This publisher's note contains corrections to Opt. Lett.45, 13 (2020).OPLEDP0146-959210.1364/OL.45.000013.