Monolithically Integrated Perovskite Semiconductor Lasers on Silicon Photonic Chips by Scalable Top-Down Fabrication.

Metal-halide perovskites are promising lasing materials for the realization of monolithically integrated laser sources, the key components of silicon photonic integrated circuits (PICs). Perovskites can be deposited from solution and require only low-temperature processing, leading to significant cost reduction and enabling new PIC architectures compared to state-of-the-art lasers realized through the costly and inefficient hybrid integration of III-V semiconductors. Until now, however, due to the chemical sensitivity of perovskites, no microfabrication process based on optical lithography (and, therefore, on existing semiconductor manufacturing infrastructure) has been established. Here, the first methylammonium lead iodide perovskite microdisc lasers monolithically integrated into silicon nitride PICs by such a top-down process are presented. The lasers show a record low lasing threshold of 4.7 µJcm-2 at room temperature for monolithically integrated lasers, which are complementary metal-oxide-semiconductor compatible and can be integrated in the back-end-of-line processes.

Aluminum plasmonic waveguides co-integrated with Si3N4 photonics using CMOS processes.

Co-integrating CMOS plasmonics and photonics became the "sweet spot" to hit in order to combine their benefits and allow for volume manufacturing of plasmo-photonic integrated circuits. Plasmonics can naturally interface photonics with electronics while offering strong mode confinement, enabling in this way on-chip data interconnects when tailored to single-mode waveguides, as well as high-sensitivity biosensors when exposing Surface-Plasmon-Polariton (SPP) modes in aqueous environment. Their synergy with low-loss photonics can tolerate the high plasmonic propagation losses in interconnect applications, offering at the same time a powerful portfolio of passive photonic functions towards avoiding the use of bulk optics for SPP excitation and facilitating compact biosensor setups. The co-integration roadmap has to proceed, however, over the utilization of fully CMOS compatible material platforms and manufacturing processes in order to allow for a practical deployment route. Herein, we demonstrate for the first time Aluminum plasmonic waveguides co-integrated with Si3N4 photonics using CMOS manufacturing processes. We validate the data carrying credentials of CMOS plasmonics with 25 Gb/s data traffic and we confirm successful plasmonic propagation in both air and water-cladded waveguide configurations. This platform can potentially fuel the deployment of co-integrated plasmonic and photonic structures using CMOS processes for biosensing and on-chip interconnect applications.

Graphene based on-chip variable optical attenuator operating at 855 nm wavelength.

This work reports on the fabrication and characterization of a graphene based variable optical attenuator integrated on a photonic Si3N4 waveguide and operating at 855 nm wavelength. The variable optical attenuator utilizes the gate voltage dependent optical absorption of a graphene layer, located in the evanescent field of the waveguide. A maximum attenuation of 17 dB is obtained at -3 V gate voltages for a device length of 700 µm. The measured voltage dependent absorption was found to be in good agreement with theoretical simulations, taking into account inter- and intra-band optical conductivity of graphene. An outlook is given on possible margins for increasing the operation speed and reducing the insertion loss of the device, using an optimized layout and improved fabrication processes.

Integrated perovskite lasers on a silicon nitride waveguide platform by cost-effective high throughput fabrication.

Metal-halide perovskites are a class of solution processed materials with remarkable optoelectronic properties such as high photoluminescence quantum yields and long carrier lifetimes, which makes them promising for a wide range of efficient photonic devices. In this work, we demonstrate the first successful integration of a perovskite laser onto a silicon nitride photonic chip. High throughput, low cost optical lithography is used, followed by indirect structuring of the perovskite waveguide. We embed methylammonium lead tri-iodide (MAPbI3) in a pre-patterned race-track microresonator and couple the emitted light to an integrated photonic waveguide. We clearly observe the build-up of spectrally narrow lasing modes at room temperature upon a pump threshold fluence of 19.6 µJcm-2. Our results evidence the possibility of on-chip lasers based on metal-halide perovskites with industry relevance on a commercially available dielectric photonic platform, which is a step forward towards low-cost integrated photonic devices.

Infrared transparent graphene heater for silicon photonic integrated circuits.

Thermo-optical tuning of the refractive index is one of the pivotal operations performed in integrated silicon photonic circuits for thermal stabilization, compensation of fabrication tolerances, and implementation of photonic operations. Currently, heaters based on metal wires provide the temperature control in the silicon waveguide. The strong interaction of metal and light, however, necessitates a certain gap between the heater and the photonic structure to avoid significant transmission loss. Here we present a graphene heater that overcomes this constraint and enables an energy efficient tuning of the refractive index. We achieve a tuning power as low as 22 mW per free spectral range and fast response time of 3 µs, outperforming metal based waveguide heaters. Simulations support the experimental results and suggest that for graphene heaters the spacing to the silicon can be further reduced yielding the best possible energy efficiency and operation speed.

Electro-optic light modulation and THz generation in locally plasma-activated silicon nanophotonic devices.

Silicon is not an electro-optic material by itself but the required second-order optical nonlinearity can be induced by breaking the inversion symmetry of the crystal lattice. Recently, an attractive approach has been demonstrated based on a surface-activation in a CMOS-compatible HBr dry etching process. In this work, we further investigate and quantify the second-order nonlinearity induced by this process. Using THz near-field probing we demonstrate that this simple and versatile process can be applied to locally equip silicon nanophotonic chips with micro-scale areas of electro-optic activity. The realization of a first fully integrated Mach-Zehnder modulator device - based on this process - is applied to quantify the nonlinearity to an effective χ((2)) of 9 ± 1 pm/V. Analysis of the thermal stability of the induced nonlinearity reveals post-processing limitations and paths for further efficiency improvements.

Investigation of local strain distribution and linear electro-optic effect in strained silicon waveguides.

We present detailed investigations of the local strain distribution and the induced second-order optical nonlinearity within strained silicon waveguides cladded with a Si3N4 strain layer. Micro-Raman Spectroscopy mappings and electro-optic characterization of waveguides with varying width w(WG) show that strain gradients in the waveguide core and the effective second-order susceptibility χ(2)(yyz) increase with reduced w(WG). For 300 nm wide waveguides a mean effective χ(2)(yyz) of 190 pm/V is achieved, which is the highest value reported for silicon so far. To gain more insight into the origin of the extraordinary large optical second-order nonlinearity of strained silicon waveguides numerical simulations of edge induced strain gradients in these structures are presented and discussed.

Pockels effect based fully integrated, strained silicon electro-optic modulator.

We demonstrate for the first time a fully integrated electro-optic modulator based on locally strained silicon rib-waveguides. By depositing a Si3N4 strain layer directly on top of the silicon waveguide the silicon crystal is asymmetrically distorted. Thus its inversion symmetry is broken and a linear electro-optic effect is induced. Electro-optic characterization yields a record high value χ(2)(yyz) = 122 pm/V for the second-order susceptibility of the strained silicon waveguide and a strict linear dependence between the applied modulation voltage V(mod) and the resulting effective index change Δn(eff). Spatially resolved micro-Raman and terahertz (THz) difference frequency generation (DFG) experiments provide in-depth insight into the origin of the electro-optic effect by correlating the local strain distribution with the observed second-order optical activity.