ABSTRACT
The recent cost-driven transition from silver- to copper-based inks for printing on flexible substrates is connected with new key challenges. Given the high oxidation sensitivity of copper inks before, during, and after the curing process, the conductivity and thereby the device performance can be affected. Strategies to limit or even avoid this drawback include the development of metal organic decomposition (MOD) inks with selected "protective" ligands. In this study, the influence of the ligand on the oxide formation during the ink decomposition process is described using a wide variety of in situ characterization techniques. It is demonstrated that bidentate ligands provide an improved oxidation barrier, although the copper preservation mechanism has its limits: oxygen can interfere in every reduction pathway depending on the curing duration and atmospheric conditions. The generated insights can be applied in the further evolution toward ambient-curable copper MOD inks.
ABSTRACT
Silver nanowire networks have demonstrated significant potential as semi-transparent electrodes for various applications. However, for their widespread utilisation in devices, upscaled coating technologies such as screen-printing need to be explored and related to this, the formulation of suitable inks is indispensable. This work contributes to this effort by the synthesis of Ag-NW based formulations. The rheological characteristics that are essential for screen-printing are obtained by the addition of hydrophobically modified cellulose. The electrical and optical characteristics of screen-printed features on PET are compared by a Van der Pauw method and UV-vis spectroscopy. Despite the presence of the cellulose additive, the screen-printed electrodes exhibit a transmittance from 92.8% to 57.3% and a sheet resistance down to 27 Ohm sq-1. Based on the percolation theory in composites, a mathematical expression is presented, which allows the in-depth analysis of the resulting opto-electrical properties. The application potential of the nanowire-containing formulations is finally demonstrated by screen-printing functional, flexible electroluminescent devices.
ABSTRACT
Integration of electronic circuit components onto flexible materials such as plastic foils, paper and textiles is a key challenge for the development of future smart applications. Therefore, conductive metal features need to be deposited on temperature sensitive substrates in a fast and straightforward way. The feasibility of these emerging (nano-) electronic technologies depends on the availability of well-designed deposition techniques and on novel functional metal inks. As ultrasonic spray coating (USSC) is one of the most promising techniques to meet the above requirements, innovative metal organic decomposition (MOD) inks are designed to deposit silver features on plastic foils. Various amine ligands were screened and their influence on the ink stability and the characteristics of the resulting metal depositions were evaluated to determine the optimal formulation. Eventually, silver layers with excellent performance in terms of conductivity (15% bulk silver conductivity), stability, morphology and adhesion could be obtained, while operating in a very low temperature window of 70 °C-120 °C. Moreover, the optimal deposition conditions were determined via an in-depth analysis of the ultrasonically sprayed silver layers. Applying these tailored MOD inks, the USSC technique enabled smooth, semi-transparent silver layers with a tunable thickness on large areas without time-consuming additional sintering steps after deposition. Therefore, this novel combination of nanoparticle-free Ag-inks and the USSC process holds promise for high throughput deposition of highly conductive silver features on heat sensitive substrates and even 3D objects.