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1.
Polymers (Basel) ; 12(11)2020 Nov 13.
Article in English | MEDLINE | ID: mdl-33202831

ABSTRACT

This study deals with the laser stereolithography manufacturing feasibility of copper-nickel nanowire-loaded photosensitive resins. The addition of nanowires resulted in a novel resin suitable for additive manufacturing technologies based on layer-by-layer photopolymerization. The pure and nanowire-loaded resin samples were 3D printed in a similar way. Their morphological, mechanical, thermal, and chemical properties were characterized. X-ray computed tomography revealed that 0.06 vol % of the composite resin was filled with nanowires forming randomly distributed aggregates. The increase of 57% in the storage modulus and 50% in the hardness when loading the resin with nanowire was attributed to the load transfer. Moreover, the decrease in the glass transition temperature from 57.9 °C to 52.8 °C in the polymeric matrix with nanowires evidenced a decrease in the cross-linking density, leading to a higher mobility of the polymer chains during glass transition. Consequently, this research demonstrates the successful dispersion and use of copper-nickel nanowires as a reinforcement material in a commercial resin for laser stereolithography.

2.
Polymers (Basel) ; 10(12)2018 Nov 29.
Article in English | MEDLINE | ID: mdl-30961249

ABSTRACT

This study presents the additive manufacture of objects using mass-functionalized photo-resins, which are additively photopolymerized using the laser stereolithography technique. The mass functionalization is based on the incorporation of copper nanowires used as fillers at different concentrations. Cylindrical and tensile test probes are designed and manufactured in a layer-by-layer approach using a low-cost laser stereolithography system working with a layer thickness of 100   µ m . The morphological, mechanical, thermal and chemical results help to show the viability and potential that this combination of mass-functionalized resins and technological processes may have in the near future, once key challenges are solved. Finally, some potential applications are also discussed.

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