Substrate-Free Transfer of Silicon- and Metallic-Based Strain Sensors on Textile and in Composite Material for Structural Health Monitoring.

New technologies to integrate electronics and sensors on or into objects can support the growth of embedded electronics. The method proposed in this paper has the huge advantage of being substrate-free and applicable to a wide range of target materials such as fiber-based composites, widely used in manufacturing, and for which monitoring applications such as fatigue, cracks, and deformation detection are crucial. Here, sensors are first fabricated on a donor substrate using standard microelectronic processes and then transferred to the host material by direct transfer printing. Results show the viability of composites instrumented by strain gauges. Indeed, dynamic and static measurements highlight that the deformations can be detected with high sensitivity both on the surface and at various points in the depth of the composite material. Thanks to this technology, for the first time, a substrate-free piezoresistive n-doped silicon strain sensor is transferred into a composite material and characterized as a function of strain applied on it. It is shown that the transfer process does not alter the electrical behavior of the sensors that are five times more sensitive than extensively used metallic ones. An application designed for monitoring the deformation of a rudder foil with a classic NACA profile in real time is presented.

An Improved Fabrication Technique for the 3-D Frequency Selective Surface based on Water Transfer Printing Technology.

Manufacturing an array of high-quality metallic pattern layers on a dielectric substrate remains a major challenge in the development of flexible and 3-D frequency selective surfaces (FSS). This paper proposes an improved fabrication solution for the 3-D FSS based on water transfer printing (WTP) technology. The main advantages of the proposed solution are its ability to transform complicated 2-D planar FSS patterns into 3-D structures while improving both manufacturing quality and production costs. WTP technology makes use of water surface tension to keep the thin metallic patterns of the proposed FSS floating flat with the absence of a solid planar substrate. This feature enables these metallic FSS patterns to be transferred onto 3-D structures through a dipping process. To test the effectiveness of the proposed technique, the FSS was designed using computer simulation software Microwave Studio to obtain the numerical performance of the FSS structure. The WTP technology was then used to fabricate the proposed FSS prototype before its performance was tested experimentally. The measurement results agreed well with the numerical results, indicating the proposed manufacturing solution would support the development of complicated 3-D electronics devices, such as conformal antenna arrays and metamaterials.

High performance of 3D silicon nanowires array@CrN for electrochemical capacitors.

Silicon nanowire (SiNW) arrays were coated with chromium nitride (CrN) for use as supercapacitor electrodes. The CrN layer of different thicknesses was deposited onto SiNWs using bipolar magnetron sputtering method. The areal capacitance of the SiNWs-CrN, as measured in 0.5 M H2SO4 electrolyte, was as high as 180 mF cm-2 at a scan rate of 5 mV s-1 (equivalent to 31.8 mF cm-2 at 1.6 mA cm-2) with an excellent electrochemical retention of 92% over 15 000 cycles. This work paves the way toward using CrN modified 3D SiNWs arrays for micro-supercapacitor application.

The Use of a Water Soluble Flexible Substrate to Embed Electronics in Additively Manufactured Objects: From Tattoo to Water Transfer Printed Electronics.

The integration of electronics into the process flow of the additive manufacturing of 3D objects is demonstrated using water soluble films as a temporary flexible substrate. Three process variants are detailed to evaluate their capabilities to meet the additive manufacturing requirements. One of them, called water transfer printing, shows the best ability to fabricate electronics onto 3D additively manufactured objects. Moreover, a curved capacitive touchpad hidden by color films is successfully transferred onto the 3D objects, showing a potential application of this technology to fabricate fully additively manufactured discrete or even hidden electronic devices.

Direct Integration of Red-NIR Emissive Ceramic-like An M6 Xi8 Xa6 Metal Cluster Salts in Organic Copolymers Using Supramolecular Interactions.

Hybrid nanomaterials made of inorganic nanocomponents dispersed in an organic host raise an increasing interest as low-cost solution-processable functional materials. However, preventing phase segregation while allowing a high inorganic doping content remains a major challenge, and usual methods require a functionalization step prior integration. Herein, we report a new approach to design such nanocomposite in which ceramic-like metallic nanocluster compounds are embedded at 10 wt % in organic copolymers, without any functionalization. Dispersion homogeneity and stability are ensured by weak interactions occurring between the copolymer lateral chains and the nanocluster compound. Hybrids could be ink-jet printed and casted on a blue LED. This proof-of-concept device emits in the red-NIR area and generates singlet oxygen, O2 (1 Δg), of particular interest for lights, display, sensors or photodynamic based therapy applications.

Conformal Electronics Wrapped Around Daily Life Objects Using an Original Method: Water Transfer Printing.

The water transfer printing method is used to transfer patterned films on random three-dimensional objects. This industrially viable technology has been demonstrated to intimately wrap metallic and polymeric films around different materials. This method avoids the use of rigid substrate during the transfer step. Patterns can be transferred to objects without folds even when holed, addressing a challenging issue in the field of conformal electronics. This technique allows high film bending properties to be reached. This promising method enables us to integrate large-area films onto daily life objects. A bent capacitive touchpad is fabricated showing the potential applications of this technology.

Epoxy Based Ink as Versatile Material for Inkjet-Printed Devices.

Drop on Demand inkjet printing is an attractive method for device fabrication. However, the reliability of the key printing steps is still challenging. This explains why versatile functional inks are needed. Epoxy based ink described in this study could solve this critical issue because it can be printed with low drawbacks (satellites droplets, long-lived filaments, etc.). Moreover, a wide concentration range of solute allows the fabrication of films from thin to high aspect ratio. Optimizing experimental parameters (temperature, overlap) and ink composition (single or cosolvent) is useful to tune the film profile. As a result, many shapes can be obtained such as donuts or hemispherical caps for a droplet and smooth or wavy shape for a thin film. This study demonstrates that epoxy based versatile ink can be used in numerous fields of applications (organic electronics, optics, sensors, MEMS, etc.). To prove this assertion, organic field effect transistors and light emitting films have been fabricated.

Split and flow: reconfigurable capillary connection for digital microfluidic devices.

Supplying liquid to droplet-based microfluidic microsystems remains a delicate task facing the problems of coupling continuous to digital or macro- to microfluidic systems. Here, we take advantage of superhydrophobic microgrids to address this problem. Insertion of a capillary tube inside a microgrid aperture leads to a simple and reconfigurable droplet generation setup.

Zipping effect on omniphobic surfaces for controlled deposition of minute amounts of fluid or colloids.

When a drop sits on a highly liquid-repellent surface (super-hydrophobic or super-omniphobic) made of periodic micrometer-sized posts, its contact-line can recede with very weak mechanical retention providing that the liquid stays on top of the microsized posts. Occurring in both sliding and evaporation processes, the achievement of low-contact-angle hysteresis (low retention) is required for discrete microfluidic applications involving liquid motion or self-cleaning; however, careful examination shows that during receding, a minute amount of liquid is left on top of the posts lying at the receding edge of the drop. For the first time, the heterogeneities of these deposits along the drop-receding contact-line are underlined. Both nonvolatile liquid and particle-laden water are used to quantitatively characterize what rules the volume distribution of deposited liquid. The experiments suggest that the dynamics of the liquid de-pinning cascade is likely to select the volume left on a specific post, involving the pinch-off and detachment of a liquid bridge. In an applied prospective, this phenomenon dismisses such surfaces for self-cleaning purposes, but offers an original way to deposit controlled amounts of liquid and (bio)-particles at well-targeted locations.

Engineering sticky superomniphobic surfaces on transparent and flexible PDMS substrate.

Following the achievement of superhydrophobicity which prevents water adhesion on a surface, superomniphobicity extends this high repellency property to a wide range of liquids, including oils, solvents, and other low surface energy liquids. Recent theoretical approaches have yield to specific microstructures design criterion to achieve such surfaces, leading to superomniphobic structured silicon substrate. To transfer this technology on a flexible substrate, we use a polydimethylsiloxane (PDMS) molding process followed by surface chemical modification. It results in so-called sticky superomniphobic surfaces, exhibiting large apparent contact angles (>150°) along with large contact angle hysteresis (>10°). We then focus on the modified Cassie equation, considering the 1D aspect of wetting, to explain the behavior of droplets on these surfaces and compare experimental data to previous works to confirm the validity of this model.