ABSTRACT
Due to digital micromirrors device (DMD) digital lithography limited by non-integer pixel errors, the edge smoothness of the exposed image is low and the sawtooth defects are obvious. To improve the image edge smoothness, an optimized pixel overlay method was proposed, which called the DMD digital lithography based on dynamic blur effect matching pixel overlay technology. The core of this method is that motion blur effect is cleverly introduced in the process of pixel overlap to carry out the lithography optimization experiment. The simulation and experimental results showed that the sawtooth edge was reduced from 1.666â µm to 0.27â µm by adopting the 1/2 dynamic blur effect to match pixel displacement superposition, which is far less than half of the sawtooth edge before optimization. The results indicated that the proposed method can efficiently improve the edge smoothness of lithographic patterns. We believe that the proposed optimization method can provide great help for high fidelity and efficient DMD digital lithography microfabrication.
ABSTRACT
Microgroove structures with helical pitches in a wavelength level are increasingly required in optical areas. However, conventional manufacturing techniques generate relatively high stresses during pressing, resulting in poor precision when forming microgrooves. This paper reports on the mechanism of the ultrasonic vibration-assisted microgroove forming of precise hot-pressed optical glass. A finite element (FE) thermocompression model of the viscoelastic material was developed and the entire forming process was numerically simulated using coupled thermal-structural analysis. The analysis of several process parameters was carried out using orthogonal experiments, from which the optimum combination of parameters was selected. The glass thermoforming process is also assisted by ultrasonic vibration. The thermal and mechanical effects of vibration improved material flow and optimized forming results. The average maximum stress in the glass during the forming process was only 3.04 × 10-3 Mpa, while the maximum stress in the hot-pressing stage without ultrasound was 1.648 Mpa. The stress results showed that the material-forming stress is significantly reduced.