ABSTRACT
The electronic structure of the Sn-added p-type SnO thin film was examined using x-ray absorption spectroscopy (XAS). Sn was intentionally added to a pristine SnO film, and the film was annealed to form p-type SnO. Sn L1- and L3-edge XAS was used to examine the oxidation states of the Sn-added p-type SnO. Compared to the case of the reference SnO, the spectrum of the Sn-added SnO (after annealing) partly contained the lineshape for SnO2, suggesting that the oxidation of Sn + SnO was progressed such that the film became preferably SnO2 + SnO rather than Sn + SnO2. O K-edge XAS, x-ray photoelectron spectroscopy (XPS), and spectroscopic ellipsometry (SE) were also used to scrutinize the electronic structure. The direct bandgap of the annealed film was estimated to be ~3.6 eV, consistent with the reported SnO2 bandgap, while that of the as-deposited Sn-added SnO was <2.5 eV. The large bandgap after annealing suggests that the metallic Sn was no longer in existence and manifested the functionality of the annealed Sn + SnO as a p-type semiconductor.
ABSTRACT
The programming characteristics of charge trap flash memory device adopting amorphous In2Ga2ZnO7 (a-IGZO) oxide semiconductors as channel layer were evaluated. Metal-organic chemical vapor deposition (MOCVD) and RF-sputtering processes were used to grow a 45 nm thick a-IGZO layer on a 20 nm thick SiO2 (blocking oxide)/p++-Si (control gate) substrate, where 3 nm thick atomic layer deposited Al2O3 (tunneling oxide) and 5 nm thick low-pressure CVD Si3N4 (charge trap) layers were intervened between the a-IGZO and substrate. Despite the identical stoichiometry and other physicochemical properties of the MOCVD and sputtered a-IGZO, a much faster programming speed of MOCVD a-IGZO was observed. A comparable amount of oxygen vacancies was found in both MOCVD and sputtered a-IGZO, confirmed by x-ray photoelectron spectroscopy and bias-illumination-instability test measurements. Ultraviolet photoelectron spectroscopy analysis revealed a higher Fermi level (E F) of the MOCVD a-IGZO (â¼0.3 eV) film than that of the sputtered a-IGZO, which could be ascribed to the higher hydrogen concentration in the MOCVD a-IGZO film. Since the programming in a flash memory device is governed by the tunneling of electrons from the channel to charge trapping layer, the faster programming performance could be the result of a higher E F of MOCVD a-IGZO.
ABSTRACT
p-Type SnO thin films were deposited on a Si substrate by a cosputtering process using ceramic SnO and metal Sn targets at room temperature without adding oxygen. By varying the dc sputtering power applied to the Sn target while maintaining a constant radio frequency power to the SnO target, the Sn/O ratio varied from 56:44 to 74:26 at the as-deposited state. After thermal annealing at 180 °C for 25 min under air atmosphere using a microwave annealing system, the films were crystallized into tetragonal SnO when the Sn/O ratio increased from 44:56 to 57:43. Notably, the metallic Sn remained when the Sn/O ratio was higher than 55:45 at an annealed state. When the ratio was lower than 55:45 at the annealed state, the incorporated Sn fully oxidized to SnO, making the films useful p-type semiconductors, whereas the films became metallic conductors at higher Sn/O ratios. At the Sn/O ratio of 55:45 at the annealed state, the film showed the highest Hall mobility of 8.8 cm2 V-1 s-1 and a hole concentration of 5.4 × 1018 cm-3. Interestingly, the electrical conduction behavior showed trap-mediated hopping when the Sn metal was cosputtered, whereas the single SnO film showed regular band conduction behavior. The residual stress effect could interpret such property variation originated from the sputtering power and postoxidation-induced volumetric effects. This report makes a critical contribution to the in-depth understanding of the composition-structure-property relationship of this technically important thin film material.
