ABSTRACT
The large fraction of material residing at grain boundaries in nanocrystalline metals and alloys is responsible for their ultrahigh strength, but also undesirable microstructural instability under thermal and mechanical loads. However, the underlying mechanism of stress-driven microstructural evolution is still poorly understood and precludes rational alloy design. Here we combine quantitative in situ electron microscopy with three-dimensional atom-probe tomography to directly link the mechanics and kinetics of grain boundary migration in nanocrystalline Al films with the excess of O atoms at the boundaries. Site-specific nanoindentation leads to grain growth that is retarded by impurities, and enables quantification of the critical stress for the onset of grain boundary migration. Our results show that a critical excess of impurities is required to stabilize interfaces in nanocrystalline materials against mechanical driving forces, providing new insights to guide control of deformation mechanisms and tailoring of mechanical properties apart from grain size alone.
ABSTRACT
Tapered nanopillar structures of different cross-sectional geometries including cone-, pencil-like, and stepwise are prepared from anodized aluminum oxide templates. The shape effect on the adhesion strength is investigated in experiments and simulation. Cone-shaped nanopillars are highly bendable under load and can recover after unloading, thus, warranting high adhesion strength, 34 N cm(-2) . The pencil-like and stepwise nano-pillars are, however, easily fractured and are not recoverable under the same conditions.