ABSTRACT
Electrostatic imprinting is a highly suitable process for patterning large area and high efficiency glasses because it enables glass patterning at low temperatures with low pressures. Because high DC voltage bias is applied to the mold and glass during the thermal imprinting, the mold materials should have electrical conductivity, appropriate glass adhesion properties, and excellent thermal and electrochemical stability. In this study, thin Pt/Ni molds were fabricated via Si micromachining and electroforming techniques and were then used in the electrostatic imprint process in order to evaluate their feasibility as molds. Under the investigated process conditions, the pattern transfer to glass was accomplished without noticeable degradation of the mold. Furthermore, the process parameter effects on replication fidelity and potential defects were investigated.
