Top-down Approach for the Direct Synthesis, Patterning, and Operation of Artificial Micromuscles on Flexible Substrates.

Recent progress in the field of microsystems on flexible substrates raises the need for alternatives to the stiffness of classical actuation technologies. This paper reports a top-down process to microfabricate soft conducting polymer actuators on substrates on which they ultimately operate. The bending microactuators were fabricated by sequentially stacking layers using a layer polymerization by layer polymerization of conducting polymer electrodes and a solid polymer electrolyte. Standalone microbeams thinner than 10 µm were fabricated on SU-8 substrates associated with a bottom gold electrical contact. The operation of microactuators was demonstrated in air and at low voltage (±4 V).

Lead zirconate titanate nanoscale patterning by ultraviolet-based lithography lift-off technique for nano-electromechanical system applications.

The advantage of using lead zirconate titanate (PbZr(0.54)Ti(0.46)O(3)) ceramics as an active material in nanoelectromechanical systems (NEMS) comes from its relatively high piezoelectric coefficients. However, its integration within a technological process is limited by the difficulty of structuring this material with submicrometer resolution at the wafer scale. In this work, we develop a specific patterning method based on optical lithography coupled with a dual-layer resist process. The main objective is to obtain sub-micrometer features by lifting off a 100-nm-thick PZT layer while preserving the material's piezoelectric properties. A subsequent result of the developed method is the ability to stack several layers with a lateral resolution of few tens of nanometers, which is mandatory for the fabrication of NEMS with integrated actuation and read-out capabilities.

Integrative technology-based approach of microelectromechanical systems (MEMS) for biosensing applications.

In this work we simultaneously aim at addressing the design and fabrication of microelectromechanical systems (MEMS) for biological applications bearing actuation and readout capabilities together with adapted tools dedicated to surface functionalization at the microscale. The biosensing platform is based on arrays of silicon micromembranes with piezoelectric actuation and piezoresistive read-out capabilities. The detection of the cytochrome C protein using molecularly imprinted polymers (MIPs) as functional layer is demonstrated. The adapted functionalization tool specifically developed to match the micromembranes' platform is an array of silicon cantilevers incorporating precise force sensors for the trim and force measurements during deposition of biological materials onto the sensors' active area. In either case, associated analog electronics is specifically realized to deal with specific signals treatment fed through the MEMS-based devices.

SU-8-based nanocomposites for acoustical matching layer.

SU-8, an epoxy-based photoresist, was introduced as the acoustical matching layer between silicon and water for lab-on-chip applications integrating acoustic characterization. Acoustical performances, including the acoustic longitudinal wave velocity and attenuation of the SU-8-based matching layer, were characterized at a frequency of 1 GHz at room temperature. The gain in echo characterization with a SU-8/SiO2 bilayer and with different nanocomposite monolayers made of SU-8 and TiO2 nanoparticles (size around 35 nm) between silicon and water was characterized as being above 10 dB in each case. With the increase of concentration of TiO2 in SU-8 based composites from 0 to 30 wt%, acoustical impedance of the nanocomposites increased from about 3 to 6 MRayls, respectively. The acoustical attenuation in the nanocomposites is between 0.5 and 0.6 dB/microm. The most efficient matching was obtained with the nanocomposite integrating 30 wt% TiO2 nanoparticles, with which the enhanced loss is about 0.34 dB as the attenuation is about 0.5 dB/microm. This type of matching layer has potential applications in lab-on-chip technology for high frequency transducers or in the fabrication of high frequency piezocomposites.