ABSTRACT
199Three-dimensional (3D) scaffolds composed of various biomaterials, including metals, ceramics, and synthetic polymers, have been widely used to regenerate bone defects. However, these materials possess clear downsides, which prevent bone regeneration. Therefore, composite scaffolds have been developed to compensate these disadvantages and achieve synergetic effects. In this study, a naturally occurring biomineral, FeS2, was incorporated in PCL scaffolds to enhance the mechanical properties, which would in turn influence the biological characteristics. The composite scaffolds consisting of different weight fractions of FeS2 were 3D printed and compared to pure PCL scaffold. The surface roughness (5.77-fold) and the compressive strength (3.38-fold) of the PCL scaffold was remarkably enhanced in a dose-dependent manner. The in vivo results showed that the group with PCL/ FeS2 scaffold implanted had increased neovascularization and bone formation (2.9-fold). These results demonstrated that the FeS2 incorporated PCL scaffold might be an effective bioimplant for bone tissue regeneration.
ABSTRACT
This study reveals a methodological research for predicting mechanical properties of phosphor films through the chemical crosslinking reaction of methyl silicone resin during fabrication of the phosphor films. Crosslinking point according to the type of methyl silicone resins was verified through the magnitude of the absorption peak of the functional group and the curing reaction heat. Then, we measured mechanical properties of the fabricated phosphor films. As a result, it was figured out that the number of the crosslinking point was directly proportional to the total curing reaction heat, and also affected the mechanical properties of the phosphor films. Based on the correlation of curing reaction heat and crosslinking point of the methyl silicone resins and mechanical properties of the fabricated phosphor films, we proposed a methodology that can understand and control the phosphor films in advance of finishing the fabrication of the final phosphor products.
ABSTRACT
Silicone resin has recently attracted great attention as a high-power Light Emitting Diode (LED) encapsulant material due to its good thermal stability and optical properties. In general, the abrupt curing reaction of the silicone resin for the LED encapsulant during the curing process induces reduction in the mechanical and optical properties of the LED product due to the generation of residual void and moisture, birefringence, and residual stress in the final formation. In order to prevent such an abrupt curing reaction, the reduction of residual void and birefringence of the silicone resin was observed through experimentation by introducing the multi-step cure processes, while the residual stress was calculated by conducting finite element analysis that coupled the heat of cure reaction and cure shrinkage. The results of experiment and analysis showed that it was during the three-step curing process that the residual void, birefringence, and residual stress reduced the most in similar tendency. Through such experimentation and finite element analysis, the study was able to confirm that the optimization of the LED encapsulant packaging process was possible.