Widely tunable 2 µm hybrid laser using GaSb semiconductor optical amplifiers and a Si3N4 photonics integrated reflector.

Tunable lasers emitting in the 2-3 µm wavelength range that are compatible with photonic integration platforms are of great interest for sensing applications. To this end, combining GaSb-based semiconductor gain chips with Si3N4 photonic integrated circuits offers an attractive platform. Herein, we utilize the low-loss features of Si3N4 waveguides and demonstrate a hybrid laser comprising a GaSb gain chip with an integrated tunable Si3N4 Vernier mirror. At room temperature, the laser exhibited a maximum output power of 15 mW and a tuning range of ∼90 nm (1937-2026 nm). The low-loss performance of several fundamental Si3N4 building blocks for photonic integrated circuits is also validated. More specifically, the single-mode waveguide exhibits a transmission loss as low as 0.15 dB/cm, the 90° bend has 0.008 dB loss, and the 50/50 Y-branch has an insertion loss of 0.075 dB.

Hybrid silicon photonics DBR laser based on flip-chip integration of GaSb amplifiers and µm-scale SOI waveguides.

The development of integrated photonics experiences an unprecedented growth dynamic, owing to accelerated penetration to new applications. This leads to new requirements in terms of functionality, with the most obvious feature being the increased need for wavelength versatility. To this end, we demonstrate for the first time the flip-chip integration of a GaSb semiconductor optical amplifier with a silicon photonic circuit, addressing the transition of photonic integration technology towards mid-IR wavelengths. In particular, an on-chip hybrid DBR laser emitting in the 2 µm region with an output power of 6 mW at room temperature is demonstrated. Wavelength locking was achieved employing a grating realized using 3 µm thick silicon-on-insulator (SOI) technology. The SOI waveguides exhibit strong mode confinement and low losses, as well as excellent mode matching with GaSb optoelectronic chips ensuring low loss coupling. These narrow line-width laser diodes with an on-chip extended cavity can generate a continuous-wave output power of more than 1 mW even when operated at an elevated temperature of 45°C. The demonstration opens an attractive perspective for the on-chip silicon photonics integration of GaSb gain chips, enabling the development of PICs in a broad spectral range extending from 1.8 µm to beyond 3 µm.

Precise length definition of active GaAs-based optoelectronic devices for low-loss silicon photonics integration.

The length variation associated with standard cleaving of III-V optoelectronic chips is a major source of loss in the integration with the micron-scale silicon-on-insulator waveguides. To this end, a new, to the best of our knowledge, approach for precise definition of the III-V chip length is reported. The method employs lithography and wet etching of cleave marks outside the active III-V waveguides. The marks follow a specific crystallographic orientation and are used to initiate and guide the cleaving process. Besides minimizing the air gap between the butt-coupled III-V and Si waveguides and hence minimizing the coupling losses, the use of precisely defined length significantly improves the integration yield owing to the increased length uniformity. We apply this technique to defining the lengths of GaAs-based semiconductor optical amplifiers and demonstrate length control with an accuracy better than 250 nm per facet. This variation is more than 1 order of magnitude smaller than with the traditional cleaving methods, resulting in improvement of coupling by several dBs.