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1.
Sci Total Environ ; 926: 172139, 2024 May 20.
Artículo en Inglés | MEDLINE | ID: mdl-38569971

RESUMEN

Wastewater treatment plants (WWTPs) consume significant amount of energy to sustain their operation. From this point, the current study aims to enhance the capacity of these facilities to meet their energy needs by integrating renewable energy sources. The study focused on the investigation of two primary solar energy systems in As Samra WWTP in Jordan. The first system combines parabolic trough collectors (PTCs) with thermal energy storage (TES). This system primarily serves to fulfill the thermal energy demands of the plant by reducing the demands from boiler units, which allows more biogas for electricity generation. The second system is a photovoltaic (PV) system with Lithium-Ion batteries, which directly produces electricity that will be used to cover part of the electrical energy demands of plant. To assess the optimal configuration, two distinct scenarios have been formulated and compared to the current case scenario (SC#1). The first scenario focuses on maximizing the net present value (NPV) and minimizing the levelized cost of electricity (LCOE). The second scenario is centred on minimizing the levelized cost of heat (LCOH). The findings indicate that both scenarios succeeded in reducing the reliance on the grid to a value that reach 1 %. Moreover, they both reduced biogas percentage in energy production from 88 % to approximately 65 % through the integration of the PV system. In terms of thermal demand, SC#2 reduced the reliance on biogas boiler units from 100 % to 25 %, while SC#3 achieved an even more impressive reduction to just 8 %. The best LCOE value was attained in SC#2, at 0.0895 USD/kWh, with an NPV of 10.54 million USD. Conversely, SC# 3 yielded an LCOH value of 0.0432 USD/kWhth compared to 0.0534 USD/kWhth USD for SC#2. Despite their relatively high capital and operating costs, SC#2 and SC#3 managed to substantially decrease the annual electricity expenditure from approximately 2 million USD to 86,000 USD and 0 USD, respectively.

2.
Membranes (Basel) ; 13(10)2023 Sep 28.
Artículo en Inglés | MEDLINE | ID: mdl-37887989

RESUMEN

The adoption of Proton Exchange Membrane (PEM) fuel cells (FCs) is of great significance in diverse industries, as they provide high efficiency and environmental advantages, enabling the transition to sustainable and clean energy solutions. This study aims to enhance the output power of PEM-FCs by employing the Adaptive Neuro-Fuzzy Inference System (ANFIS) and modern optimization algorithms. Initially, an ANFIS model is developed based on empirical data to simulate the output power density of the PEM-FC, considering factors such as pressure, relative humidity, and membrane compression. The Salp swarm algorithm (SSA) is subsequently utilized to determine the optimal values of the input control parameters. The three input control parameters of the PEM-FC are treated as decision variables during the optimization process, with the objective to maximize the output power density. During the modeling phase, the training and testing data exhibit root mean square error (RMSE) values of 0.0003 and 24.5, respectively. The coefficient of determination values for training and testing are 1.0 and 0.9598, respectively, indicating the successfulness of the modeling process. The reliability of SSA is further validated by comparing its outcomes with those obtained from particle swarm optimization (PSO), evolutionary optimization (EO), and grey wolf optimizer (GWO). Among these methods, SSA achieves the highest average power density of 716.63 mW/cm2, followed by GWO at 709.95 mW/cm2. The lowest average power density of 695.27 mW/cm2 is obtained using PSO.

3.
Materials (Basel) ; 16(2)2023 Jan 12.
Artículo en Inglés | MEDLINE | ID: mdl-36676490

RESUMEN

Solder joints are subjected to varied stress cycle circumstances in the electronic packaging service life but are also influenced by aging. There has been limited investigation into the influence of aging and varying cycles on SnAgCu-Bi (SAC-Bi) solder joint fatigue. Cyclic fatigue tests were performed on solder joints of several alloys, including SnAgCu (SAC305), SnAgCu-Bi (SAC-Q), and SnCu-Bi (SAC-R). Individual solder joints were cycled under varying stress levels, alternating between mild and harsh stress levels. At least seven samples were prepared for each alloy by alternating between 25 mild stress (MS) cycles and three harsh stress (HS) cycles until the solder joint broke off. The impact of aging on Bi-doped solder joints fatigue under varied amplitude stress was examined and predicted for 10 and 1000 h under 125 °C. Because of the "Step-up" phenomenon of inelastic work, a new fatigue model was developed based on the common damage accumulation (CDA) model. The experimental results revealed that aging reduced the fatigue life of the tested solder alloys, particularly that of SAC305. According to the CDA model, all solder alloys failed earlier than expected after aging. The proposed model uses the amplification factor to assess inelastic work amplification after switching between the MS and HS cycles under varying stress amplitude conditions. The amplification factor for the SAC-Bi solder alloys increased linearly with fracture initiation and substantially followed crack propagation until the final failure. Compared with existing damage accumulation models, the proposed fatigue model provides a more accurate estimation of damage accumulation. For each case, the cut-off positions were examined. The SAC-Q amplification factor increased linearly to 83% of its overall life, which was much higher than that of SAC305 and SAC-R. This study identified three distinct failure modes: ductile, brittle, and near intermetallic compound (IMC) failure. It was also observed that SAC-Q with an organic solderability preservatives (OSP) surface finish was more susceptible to brittle failure owing to the excessive brittleness of the alloy material.

4.
Materials (Basel) ; 15(19)2022 Sep 29.
Artículo en Inglés | MEDLINE | ID: mdl-36234099

RESUMEN

The surface finish (SF) becomes a part of the solder joint during assembly and improves the component's reliability. Furthermore, the SF influences the solder joint's reliability by affecting the thickness of the intermetallic compound (IMC) layer at the solder interface and copper pads. In this experiment, five different alloys are used and compared with the SAC305 alloy, two of which, Innolot and SAC-Bi, are bi-based solder alloys. This study includes three common SFs: electroless nickel immersion gold (ENIG), immersion silver (ImAg), and organic solderability preserve (OSP). The performance of three surface finishes is examined in terms of component characteristic life. All of the boards were isothermally aged for twelve months at 125 °C. The boards were then exposed to 5000 cycles of thermal cycling at temperatures ranging from -40-+125 °C. Most of the current research considers only one or two factors affecting the reliability of the electronic package. This study combines the effect of multiple factors, including solder paste content, SF, isothermal aging, and thermal cycling, to ensure that the test conditions represent real-world applications. In addition, the electronics packages are assembled using commercialized alloys. The current study focuses on a high-performance alloy already present in the electronic market. The failure data were analyzed statistically using the Weibull distribution and design of experiments (DOE) analysis of variance (ANOVA) techniques. The findings reveal that the micro and uniformly distributed precipitates in solder microstructures are critical for high-reliability solder joints. Re-crystallization of the thermally cycled solder joints promotes the local formation of numerous new grains in stress-concentrated zones. As the fracture spreads along these grain boundaries and eventually fails, these new grains participate in crack propagation. Aging significantly worsens this situation. Finally, although the ENIG surface finish with its Ni layer outperforms other SFs, this does not imply that ENIG is more reliable in all solder paste/sphere/finish combinations.

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