Comparison of Anodic and Au-Au Thermocompression Si-Wafer Bonding Methods for High-Pressure Microcooling Devices.

Silicon-based microchannel technology offers unmatched performance in the cooling of silicon pixel detectors in high-energy physics. Although Si-Si direct bonding, used for the fabrication of cooling plates, also meets the stringent requirements of this application (its high-pressure resistance of ~200 bar, in particular), its use is reported to be a challenging and expensive process. In this study, we evaluated two alternative bonding methods, aiming toward a more cost-effective fabrication process: Si-Glass-Si anodic bonding (AB) with a thin-film glass, and Au-Au thermocompression (TC). The bonding strengths of the two methods were evaluated with destructive pressure burst tests (0-690 bar) on test structures, each made of a 1 × 2 cm2 silicon die etched with a tank and an inlet channel and sealed with a plain silicon die using either the AB or TC bonding. The pressure resistance of the structures was measured to be higher for the TC-sealed samples (max. 690 bar) than for the AB samples (max. 530 bar), but less homogeneous. The failure analysis indicated that the AB structure resistance was limited by the adhesion force of the deposited layers. Nevertheless, both the TC and AB methods provided sufficient bond quality to hold the high pressure required for application in high-energy physics pixel detector cooling.

Microfluidics for High Pressure: Integration on GaAs Acoustic Biosensors with a Leakage-Free PDMS Based on Bonding Technology.

Microfluidics integration of acoustic biosensors is an actively developing field. Despite significant progress in "passive" microfluidic technology, integration with microacoustic devices is still in its research state. The major challenge is bonding polymers with monocrystalline piezoelectrics to seal microfluidic biosensors. In this contribution, we specifically address the challenge of microfluidics integration on gallium arsenide (GaAs) acoustic biosensors. We have developed a robust plasma-assisted bonding technology, allowing strong connections between PDMS microfluidic chip and GaAs/SiO2 at low temperatures (70 °C). Mechanical and fluidic performances of fabricated device were studied. The bonding surfaces were characterized by water contact angle measurement and ATR-FTIR, AFM, and SEM analysis. The bonding strength was characterized using a tensile machine and pressure/leakage tests. The study showed that the sealed chips were able to achieve a limit of high bonding strength of 2.01 MPa. The adhesion of PDMS to GaAs was significantly improved by use of SiO2 intermediate layer, permitting the bonded chip to withstand at least 8.5 bar of burst pressure. The developed bonding approach can be a valuable solution for microfluidics integration in several types of MEMS devices.

High-fidelity glass micro-axicons fabricated by laser-assisted wet etching.

We report on the fabrication of micro-axicons made of glass by laser-assisted wet etching (LAE) and laser polishing. The employed technique, relying on a direct-writing process using a femtosecond laser, allows revealing high fidelity profiles when the exposed glass samples are etched in a heated potassium hydroxide (KOH) solution. The remaining surface roughness is then decreased by carbon dioxide (CO2) laser polishing. Such polishing is limited to the superficial layer of the component so that the tip is only slightly rounded, with a radius of curvature of nearly 200 µm. It is then shown with 500 µm-diameter axicons that a quasi-Bessel beam is generated closely after the tip and features a 5.3 µm diameter maintained over a propagation distance of almost 3.5 mm.

Correction: Galenic lab-on-a-chip concept for lipid nanocapsules production.

Correction for 'Galenic Lab-on-a-Chip concept for lipid nanocapsules production' by Nicolas Rolley et al., Nanoscale, 2021, 13, 11899-11912, DOI: 10.1039/D1NR00879J.

Galenic Lab-on-a-Chip concept for lipid nanocapsules production.

The continuous production of drug delivery systems assisted by microfluidics has drawn a growing interest because of the high reproducibility, low batch-to-batch variations, narrow and controlled particle size distributions and scale-up ease induced by this kind of processes. Besides, microfluidics offers opportunities for high throughput screening of process parameters and the implementation of process characterization techniques as close to the product as possible. In this context, we propose to spotlight the GALECHIP concept through the development of an instrumented microfluidic pilot considered as a Galenic Lab-on-a-Chip to formulate nanomedicines, such as lipid nanocapsules (LNCs), under controlled process conditions. In this paper we suggest an optimal rational development in terms of chip costs and designs. First, by using two common additive manufacturing techniques, namely fused deposition modelling and multi-jet modelling to prototype customized 3D microfluidic devices (chips and connectors). Secondly, by manufacturing transparent Silicon (Si)/Glass chips with similar channel geometries but obtained by a new approach of deep reactive ion etching (DRIE) technology suitable with in situ small angle X-ray scattering characterizations. LNCs were successfully produced by a phase inversion composition (PIC) process with highly monodispersed sizes from 25 nm to 100 nm and formulated using chips manufactured by 3D printing and DRIE technologies. The transparent Si/Glass chip was also used for the small angle X-ray scattering (SAXS) analysis of the LNC formulation with the PIC process. The 3D printing and DRIE technologies and their respective advantages are discussed in terms of cost, easiness to deploy and process developments in a GALECHIP point of view.

Real-time Lissajous imaging with a low-voltage 2-axis MEMS scanner based on electrothermal actuation.

Laser scanning based on Micro-Electro-Mechanical Systems (MEMS) scanners has become very attractive for biomedical endoscopic imaging, such as confocal microscopy or Optical Coherence Tomography (OCT). These scanners are required to be fast to achieve real-time image reconstruction while working at low actuation voltage to comply with medical standards. In this context, we report a 2-axis Micro-Electro-Mechanical Systems (MEMS) electrothermal micro-scannercapable of imaging large fields of view at high frame rates, e.g. from 10 to 80 frames per second. For this purpose, Lissajous scan parameters are chosen to provide the optimal image quality within the scanner capabilities and the sampling rate limit, resulting from the limited A-scan rate of typical swept-sources used for OCT. Images of 233 px × 203 px and 53 px × 53 px at 10 fps and 61 fps, respectively, are experimentally obtained and demonstrate the potential of this micro-scannerfor high definition and high frame rate endoscopic Lissajous imaging.

Technological Platform for Vertical Multi-Wafer Integration of Microscanners and Micro-Optical Components.

We describe an original integration technological platform for the miniaturization of micromachined on-chip optical microscopes, such as the laser scanning confocal microscope. The platform employs the multi-wafer vertical integration approach, combined with integrated glass-based micro-optics as well as micro-electro-mechanical systems (MEMS) components, where the assembly uses the heterogeneous bonding and interconnecting technologies. Various heterogeneous components are disposed in vertically stacked building blocks (glass microlens, MEMS actuator, beamsplitter, etc.) in a minimum space. The platform offers the integrity and potential of MEMS microactuators integrated with micro-optics, providing miniaturized and low cost solutions to create micromachined on-chip optical microscopes.

An Optical Diffuse Reflectance Model for the Characterization of a Si Wafer with an Evaporated SiO2 Layer.

Thin films are a type of coating that have a very wide spectrum of applications. They may be used as single layers or composed in multilayer stacks, which significantly extend their applications. One of the most commonly used material for thin films is silicon dioxide, SiO2. Although there are other tools that can be used to measure the thickness of SiO2 films, these tools are very complex and sophisticated. In this article, we propose the use of an exponential two-layer light-material interaction model, throughout its diffuse reflectance spectra, as an alternative for the measurement of the thickness of evaporated SiO2 on Si wafers. The proposed model is evaluated experimentally by means of a 980-nm-thick SiO2 layer evaporated on a Si wafer. The results show that the proposed model has a strong correlation with the thickness measurements obtained using commercial equipment.

Miniature Schwarzschild objective as a micro-optical component free of main aberrations: concept, design, and first realization with silicon-glass micromachining.

This paper presents the conception of a new micro-optical component fabricated within the wafer-level approach: a micromachined reflective objective, the so-called micro-Schwarzschild objective, characterized by superior optical performances than widespread microlenses. The system, made of two vertically integrated mirrors, works in transmission similarly as microlenses. While the specific geometric configuration of the two-mirrors allows elimination of most common optical aberrations, the reflective architecture provides inherent achromaticity. This paper presents in detail the optical design and analyzes fabrication tolerances. It also describes a fabrication flow chart based on silicon micromachining done at the wafer level that could allow production of thousands of such micro-optical devices within a single fabrication run. The realized prototype employs the two-step KOH etching process to generate the micromirror pairs followed by glass reflow for the secondary mirror generation and selective metallic deposition. Despite an insufficient mirror quality attributed to this specific silicon etching technique and highlighted by the reflective configuration, the objective fabrication in terms of alignment, bonding, and coating is shown as feasible.

Wafer-level fabrication of multi-element glass lenses: lens doublet with improved optical performances.

This Letter reports on the fabrication of glass lens doublets arranged in arrays and realized at wafer level by means of micro-fabrication. The technique is based on the accurate vertical assembly of separately fabricated glass lens arrays. Since each one of these arrays is obtained by glass melting in silicon cavities, silicon is employed as a spacer in order to build a well-aligned and robust optical module. It is shown that optical performance achieved by the lens doublet is better than for a single lens of equivalent numerical aperture, thanks to lower optical aberrations. The technique has good potential to match the optical requirements of miniature imaging systems.

Micro-optical design of a three-dimensional microlens scanner for vertically integrated micro-opto-electro-mechanical systems.

This paper presents the optical design of a miniature 3D scanning system, which is fully compatible with the vertical integration technology of micro-opto-electro-mechanical systems (MOEMS). The constraints related to this integration strategy are considered, resulting in a simple three-element micro-optical setup based on an afocal scanning microlens doublet and a focusing microlens, which is tolerant to axial position inaccuracy. The 3D scanning is achieved by axial and lateral displacement of microlenses of the scanning doublet, realized by micro-electro-mechanical systems microactuators (the transmission scanning approach). Optical scanning performance of the system is determined analytically by use of the extended ray transfer matrix method, leading to two different optical configurations, relying either on a ball lens or plano-convex microlenses. The presented system is aimed to be a core component of miniature MOEMS-based optical devices, which require a 3D optical scanning function, e.g., miniature imaging systems (confocal or optical coherence microscopes) or optical tweezers.

Impact of mirror spider legs on imaging quality in Mirau micro-interferometry.

We report the impact on imaging quality of mirror suspensions, referred to as spider legs, used to support the reference mirror in a Mirau micro-interferometer that requires the vertical alignment of lens, mirror, and beamsplitter. Because the light goes from the microlens to the beamsplitter through the mirror plane, the spider legs are a source of diffraction. This impact is studied as a function of different parameters of the spider legs design. Imaging criteria, such as the resolution as well as the symmetry of the imaging system, are determined using the point spread function and the modulation transfer function of the pupil. These imaging criteria are used to determine the optimum radius of curvature, thickness, and number of legs of the spider structure. We show that 3 curved legs give performances, with specific radius of curvature and thickness, similar to a suspension-free mirror.

Dense arrays of millimeter-sized glass lenses fabricated at wafer-level.

This paper presents the study of a fabrication technique of lenses arrays based on the reflow of glass inside cylindrical silicon cavities. Lenses whose sizes are out of the microfabrication standards are considered. In particular, the case of high fill factor arrays is discussed in detail since the proximity between lenses generates undesired effects. These effects, not experienced when lenses are sufficiently separated so that they can be considered as single items, are corrected by properly designing the silicon cavities. Complete topographic as well as optical characterizations are reported. The compatibility of materials with Micro-Opto-Electromechanical Systems (MOEMS) integration processes makes this technology attractive for the miniaturization of inspection systems, especially those devoted to imaging.

A simple method for quality evaluation of micro-optical components based on 3D IPSF measurement.

This paper presents a simple method based on the measurement of the 3D intensity point spread function for the quality evaluation of high numerical aperture micro-optical components. The different slices of the focal volume are imaged thanks to a microscope objective and a standard camera. Depending on the optical architecture, it allows characterizing both transmissive and reflective components, for which either the imaging part or the component itself are moved along the optical axis, respectively. This method can be used to measure focal length, Strehl ratio, resolution and overall wavefront RMS and to estimate optical aberrations. The measurement setup and its implementation are detailed and its advantages are demonstrated with micro-ball lenses and micro-mirrors. This intuitive method is adapted for optimization of micro-optical components fabrication processes, especially because heavy equipments and/or data analysis are not required.

Feedback-induced voltage change of a Vertical-Cavity Surface-Emitting Laser as an active detection system for miniature optical scanning probe microscopes.

We propose a novel detection technique for scanning probe microscopy based on the measuring of the feedback-induced voltage change of 780-nm VCSEL operating at constant current in far-field regime when we modulate mechanically the length of a coupled-cavity generating the feedback conditions. The voltage change of the VCSEL is produced by light back reflected from the sample to the laser cavity. Two-dimensional image probing is successfully demonstrated with high temporal resolution, offering a viable solution for miniature parallel scanning probe optical microscopes, such as confocal microscope, where the use of a photodetector is avoided. This approach opens the possibility to perform imaging tasks in a low cost and hand-held miniature device with much improved effective-space.

Desorption/ionization on silicon for small molecules:a promising alternative to MALDI TOF.

A method has been developed for laser desorption/ionization of catecholamines from porous silicon. This methodology is particularly attractive for analysis of small molecules. MALDI TOF mass spectrometry, although a very sensitive technique, utilizes matrices that need to be mixed with the sample prior to their analysis. Each matrix produces its own background, particularly in the low-molecular mass region. Therefore, detection and identification of molecules below 400 Da can be difficult. Desorption/ionization of samples deposited on porous silicon does not require addition of a matrix, thus, spectra in the low-molecular mass region can be clearly readable. Here, we describe a method for the analysis of catecholamines. While MALDI TOF is superior for proteomics/peptidomics, desorption/ionization from porous silicon can extend the operating range of a mass spectrometer for studies on metabolomics (small organic molecules and their metabolites, such as chemical neurotransmitters, prostaglandins, steroids, etc.).